Copper electrodeposition on a magnesium alloy (AZ80) with a U-shaped surface

Ching An Huang*, Yu Hu Yeh, Che Kuan Lin, Chen Yun Hsieh

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

2 Scopus citations


Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-shaped surface during the Cu electroplating process. This wetting effect could be deduced from the variation in the anodic potential during the galvanostatic etching. The corrosion resistance of the Cu-deposited AZ80 electrode can be considerably improved after Ni electroplating.

Original languageEnglish
Pages (from-to)7366-7378
Number of pages13
Issue number11
StatePublished - 2014

Bibliographical note

Publisher Copyright:
© 2014 by the authors.


  • Corrosion
  • Electrochemical reactions
  • Metal and alloys
  • Thin films


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