Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes

Y. D. Han; H. Y. Jing; S. M.L. Na; L. Y. Xu; C. M. Tan; J. Wei

doi:10.1007/s10854-011-0557-9

Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes

Y. D. Han^*, H. Y. Jing, S. M.L. Na, L. Y. Xu, C. M. Tan, J. Wei

^*Corresponding author for this work

Research output: Contribution to journal › Journal Article › peer-review

41 Scopus citations

Abstract

In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 to 100 mN increased the percentage reduction in creep strain rate from 4 to 28%, for the composite compared to SnAgCu solder after 300 s of holding.

Original language	English
Pages (from-to)	1108-1115
Number of pages	8
Journal	Journal of Materials Science: Materials in Electronics
Volume	23
Issue number	5
DOIs	https://doi.org/10.1007/s10854-011-0557-9
State	Published - 05 2012
Externally published	Yes

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title = "Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes",

abstract = "In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 to 100 mN increased the percentage reduction in creep strain rate from 4 to 28%, for the composite compared to SnAgCu solder after 300 s of holding.",

author = "Han, {Y. D.} and Jing, {H. Y.} and Na, {S. M.L.} and Xu, {L. Y.} and Tan, {C. M.} and J. Wei",

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AU - Han, Y. D.

AU - Jing, H. Y.

AU - Na, S. M.L.

AU - Xu, L. Y.

AU - Tan, C. M.

AU - Wei, J.

PY - 2012/5

Y1 - 2012/5

N2 - In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 to 100 mN increased the percentage reduction in creep strain rate from 4 to 28%, for the composite compared to SnAgCu solder after 300 s of holding.

AB - In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 to 100 mN increased the percentage reduction in creep strain rate from 4 to 28%, for the composite compared to SnAgCu solder after 300 s of holding.

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JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

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ER -

Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes

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