Deposition of stoichiometric SiO2 on silicon-germanium strained layers

B. Senapati*, S. Maikap, L. K. Bera, C. K. Maiti

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

High quality stoichiometric SiO2 films are deposited on strained-SiGe at a low temperature by microwave discharge cavity plasma. The electrical properties of deposited oxide is characterized using metal-oxide-semiconductor structure. These properties are found to be excellent potential for VLSI/ULSI applications.

Original languageEnglish
Pages (from-to)I/-
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3975
StatePublished - 2000
Externally publishedYes
EventIWPSD-99: The 10th International Workshop on the Physics of Semiconductor Devices - New Delhi, India
Duration: 14 12 199918 12 1999

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