TY - JOUR
T1 - Design of long-chain branched copolyesters and manufacture as well as physical properties of their extrusion films
AU - Lai, Chiu Chun
AU - Yu, Chun Ta
AU - Chen, Meng Hsin
AU - Chen, Hsin Lung
AU - Wang, Fu Ming
AU - Lin, Chih Hsiang
AU - Liu, Lung Chang
AU - Chen, Chien Ming
N1 - Publisher Copyright:
© 2017 Elsevier B.V.
PY - 2018/1
Y1 - 2018/1
N2 - A long-chain branched copolyester (i.e. p-hydroxybenzoic acid (HBA)/2-hydroxy-6-naphthoic acid (HNA)/1,1,1-tris(4-hydroxyphenyl)ethane (THPE) copolyester) and its extrusion film with superior physical properties to commercial Ticona A950 and Vecstar CTZ have been manufactured by the design of appropriate prescriptions, T-Die extrusion, and thermal treatment of crystal transformation. In order to investigate the fabricating feasibility for flexible copper clad laminate (FCCL) of fourth/fifth generation long-term evolution (4G/5G LTE), we have also agglutinated lab-made copolyester extrusion film with the copper foil by hot compression. Experimental results manifest that lab-made copolyester extrusion film is a highly potential FCCL substrate of 4G/5G LTE because its thickness, dielectric constant (Dk), dielectric loss (Df), hygroscopicity, yellowness index (YI), antistatic capability, flammability, melting temperature (Tm), coefficient of thermal expansion (CTE), and peel strength to copper foil are 50 μm, 2.90, 0.00140, 0.04%, 2.7, 6.5 × 109 Ω/□, UL-94 V0, 305 °C, 24.8 ppm/°C, and 29.9 lb/in, respectively.
AB - A long-chain branched copolyester (i.e. p-hydroxybenzoic acid (HBA)/2-hydroxy-6-naphthoic acid (HNA)/1,1,1-tris(4-hydroxyphenyl)ethane (THPE) copolyester) and its extrusion film with superior physical properties to commercial Ticona A950 and Vecstar CTZ have been manufactured by the design of appropriate prescriptions, T-Die extrusion, and thermal treatment of crystal transformation. In order to investigate the fabricating feasibility for flexible copper clad laminate (FCCL) of fourth/fifth generation long-term evolution (4G/5G LTE), we have also agglutinated lab-made copolyester extrusion film with the copper foil by hot compression. Experimental results manifest that lab-made copolyester extrusion film is a highly potential FCCL substrate of 4G/5G LTE because its thickness, dielectric constant (Dk), dielectric loss (Df), hygroscopicity, yellowness index (YI), antistatic capability, flammability, melting temperature (Tm), coefficient of thermal expansion (CTE), and peel strength to copper foil are 50 μm, 2.90, 0.00140, 0.04%, 2.7, 6.5 × 109 Ω/□, UL-94 V0, 305 °C, 24.8 ppm/°C, and 29.9 lb/in, respectively.
KW - Dielectric property
KW - Extrusion
KW - Liquid crystal polymer
KW - Mechanical property
KW - Thermal property
UR - https://www.scopus.com/pages/publications/85035052864
U2 - 10.1016/j.reactfunctpolym.2017.11.007
DO - 10.1016/j.reactfunctpolym.2017.11.007
M3 - 文章
AN - SCOPUS:85035052864
SN - 1381-5148
VL - 122
SP - 98
EP - 106
JO - Reactive and Functional Polymers
JF - Reactive and Functional Polymers
ER -