Determination of Biaxial Bending Strength of Thin Silicon Dies by the PoEF Test

M. Y. Tsai; J. H. Yeh; P. S. Huang; Y. W. Wang; D. L. Chen; M. K. Shih; David Tarng

doi:10.1109/IMPACT50485.2020.9268550

Determination of Biaxial Bending Strength of Thin Silicon Dies by the PoEF Test

M. Y. Tsai^*
, J. H. Yeh
, P. S. Huang
, Y. W. Wang
, D. L. Chen
, M. K. Shih
, David Tarng

^*Corresponding author for this work

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The easy-to-use point-load on elastic foundation (PoEF) test with biaxial bending stress state, similar to a conventional ball-on-ring test, is studied for determining the thin silicon die strength, which may feature geometric and contact nonlinearities. The feasibility of this test method with a linear theory is evaluated by a nonlinear finite element method (NFEM) with taking into account geometric and contact nonlinearities. The results show that the geometric nonlinearity would cause significant errors of strength calculation of using the linear theory for thin dies in this test. The NFEM results, more accurate than theoretical formulation, are proposed for calculating the strength of thin dies. As a result, the geometric nonlinearity has to be taken into account for this PoEF test, when the thin silicon dies are tested for bending strength data.

Original language	English
Title of host publication	International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings
Publisher	IEEE Computer Society
Pages	290-293
Number of pages	4
ISBN (Electronic)	9781728198514
DOIs	https://doi.org/10.1109/IMPACT50485.2020.9268550
State	Published - 21 10 2020
Event	15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Taipei, Taiwan Duration: 21 10 2020 → 23 10 2020

Publication series

Name	Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume	2020-October
ISSN (Print)	2150-5934
ISSN (Electronic)	2150-5942

Conference

Conference	15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020
Country/Territory	Taiwan
City	Taipei
Period	21/10/20 → 23/10/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

Keywords

Bending Strength
Geometric Nonlinearity
PoEF Test
Thin Silicon Die

Access to Document

10.1109/IMPACT50485.2020.9268550

Cite this

Tsai, M. Y., Yeh, J. H., Huang, P. S., Wang, Y. W., Chen, D. L., Shih, M. K., & Tarng, D. (2020). Determination of Biaxial Bending Strength of Thin Silicon Dies by the PoEF Test. In International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings (pp. 290-293). Article 9268550 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2020-October). IEEE Computer Society. https://doi.org/10.1109/IMPACT50485.2020.9268550

Tsai, M. Y. ; Yeh, J. H. ; Huang, P. S. et al. / Determination of Biaxial Bending Strength of Thin Silicon Dies by the PoEF Test. International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings. IEEE Computer Society, 2020. pp. 290-293 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

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title = "Determination of Biaxial Bending Strength of Thin Silicon Dies by the PoEF Test",

abstract = "The easy-to-use point-load on elastic foundation (PoEF) test with biaxial bending stress state, similar to a conventional ball-on-ring test, is studied for determining the thin silicon die strength, which may feature geometric and contact nonlinearities. The feasibility of this test method with a linear theory is evaluated by a nonlinear finite element method (NFEM) with taking into account geometric and contact nonlinearities. The results show that the geometric nonlinearity would cause significant errors of strength calculation of using the linear theory for thin dies in this test. The NFEM results, more accurate than theoretical formulation, are proposed for calculating the strength of thin dies. As a result, the geometric nonlinearity has to be taken into account for this PoEF test, when the thin silicon dies are tested for bending strength data.",

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Tsai, MY, Yeh, JH, Huang, PS, Wang, YW, Chen, DL, Shih, MK & Tarng, D 2020, Determination of Biaxial Bending Strength of Thin Silicon Dies by the PoEF Test. in International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings., 9268550, Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, vol. 2020-October, IEEE Computer Society, pp. 290-293, 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020, Taipei, Taiwan, 21/10/20. https://doi.org/10.1109/IMPACT50485.2020.9268550

Determination of Biaxial Bending Strength of Thin Silicon Dies by the PoEF Test. / Tsai, M. Y.; Yeh, J. H.; Huang, P. S. et al.
International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings. IEEE Computer Society, 2020. p. 290-293 9268550 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2020-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Determination of Biaxial Bending Strength of Thin Silicon Dies by the PoEF Test

AU - Tsai, M. Y.

AU - Yeh, J. H.

AU - Huang, P. S.

AU - Wang, Y. W.

AU - Chen, D. L.

AU - Shih, M. K.

AU - Tarng, David

PY - 2020/10/21

Y1 - 2020/10/21

N2 - The easy-to-use point-load on elastic foundation (PoEF) test with biaxial bending stress state, similar to a conventional ball-on-ring test, is studied for determining the thin silicon die strength, which may feature geometric and contact nonlinearities. The feasibility of this test method with a linear theory is evaluated by a nonlinear finite element method (NFEM) with taking into account geometric and contact nonlinearities. The results show that the geometric nonlinearity would cause significant errors of strength calculation of using the linear theory for thin dies in this test. The NFEM results, more accurate than theoretical formulation, are proposed for calculating the strength of thin dies. As a result, the geometric nonlinearity has to be taken into account for this PoEF test, when the thin silicon dies are tested for bending strength data.

AB - The easy-to-use point-load on elastic foundation (PoEF) test with biaxial bending stress state, similar to a conventional ball-on-ring test, is studied for determining the thin silicon die strength, which may feature geometric and contact nonlinearities. The feasibility of this test method with a linear theory is evaluated by a nonlinear finite element method (NFEM) with taking into account geometric and contact nonlinearities. The results show that the geometric nonlinearity would cause significant errors of strength calculation of using the linear theory for thin dies in this test. The NFEM results, more accurate than theoretical formulation, are proposed for calculating the strength of thin dies. As a result, the geometric nonlinearity has to be taken into account for this PoEF test, when the thin silicon dies are tested for bending strength data.

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KW - Thin Silicon Die

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Tsai MY, Yeh JH, Huang PS, Wang YW, Chen DL, Shih MK et al. Determination of Biaxial Bending Strength of Thin Silicon Dies by the PoEF Test. In International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings. IEEE Computer Society. 2020. p. 290-293. 9268550. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). doi: 10.1109/IMPACT50485.2020.9268550

Determination of Biaxial Bending Strength of Thin Silicon Dies by the PoEF Test

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Keywords

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