Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes

Y. D. Han; S. M.L. Nai; H. Y. Jing; L. Y. Xu; C. M. Tan; J. Wei

doi:10.1007/s10854-010-0135-6

Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes

Y. D. Han, S. M.L. Nai, H. Y. Jing, L. Y. Xu, C. M. Tan, J. Wei^*

^*Corresponding author for this work

Research output: Contribution to journal › Journal Article › peer-review

85 Scopus citations

Abstract

In this study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the 95.8Sn-3.5Ag-0.7Cu solder alloy using the powder metallurgy route. Up to 0.3 wt% of Ni-CNTs were successfully incorporated. The effects of Ni-CNTs on the physical, thermal and mechanical properties of Sn-Ag-Cu solder alloy were investigated. With the addition of increasing weight percentages of Ni-CNTs, the composite solders showed a corresponding decrease in density values and improved wetting properties. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Mechanical characterization revealed an improvement in ultimate tensile strength (up to 12%) and 0.2% yield strength (up to 8%) with the addition of 0.05 wt% Ni-CNTs in the solder.

Original language	English
Pages (from-to)	315-322
Number of pages	8
Journal	Journal of Materials Science: Materials in Electronics
Volume	22
Issue number	3
DOIs	https://doi.org/10.1007/s10854-010-0135-6
State	Published - 03 2011
Externally published	Yes

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title = "Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes",

abstract = "In this study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the 95.8Sn-3.5Ag-0.7Cu solder alloy using the powder metallurgy route. Up to 0.3 wt% of Ni-CNTs were successfully incorporated. The effects of Ni-CNTs on the physical, thermal and mechanical properties of Sn-Ag-Cu solder alloy were investigated. With the addition of increasing weight percentages of Ni-CNTs, the composite solders showed a corresponding decrease in density values and improved wetting properties. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Mechanical characterization revealed an improvement in ultimate tensile strength (up to 12%) and 0.2% yield strength (up to 8%) with the addition of 0.05 wt% Ni-CNTs in the solder.",

author = "Han, {Y. D.} and Nai, {S. M.L.} and Jing, {H. Y.} and Xu, {L. Y.} and Tan, {C. M.} and J. Wei",

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AU - Han, Y. D.

AU - Nai, S. M.L.

AU - Jing, H. Y.

AU - Xu, L. Y.

AU - Tan, C. M.

AU - Wei, J.

PY - 2011/3

Y1 - 2011/3

N2 - In this study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the 95.8Sn-3.5Ag-0.7Cu solder alloy using the powder metallurgy route. Up to 0.3 wt% of Ni-CNTs were successfully incorporated. The effects of Ni-CNTs on the physical, thermal and mechanical properties of Sn-Ag-Cu solder alloy were investigated. With the addition of increasing weight percentages of Ni-CNTs, the composite solders showed a corresponding decrease in density values and improved wetting properties. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Mechanical characterization revealed an improvement in ultimate tensile strength (up to 12%) and 0.2% yield strength (up to 8%) with the addition of 0.05 wt% Ni-CNTs in the solder.

AB - In this study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the 95.8Sn-3.5Ag-0.7Cu solder alloy using the powder metallurgy route. Up to 0.3 wt% of Ni-CNTs were successfully incorporated. The effects of Ni-CNTs on the physical, thermal and mechanical properties of Sn-Ag-Cu solder alloy were investigated. With the addition of increasing weight percentages of Ni-CNTs, the composite solders showed a corresponding decrease in density values and improved wetting properties. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Mechanical characterization revealed an improvement in ultimate tensile strength (up to 12%) and 0.2% yield strength (up to 8%) with the addition of 0.05 wt% Ni-CNTs in the solder.

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Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes

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