Effect of implantation damage on transient loss of phosphorus in silicon

Ruey Dar Chang*, Jung Ruey Tsai

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

2 Scopus citations

Abstract

In this study, samples were cycled between silicon implantation and rapid thermal annealing to understand the impact of implantation damage on the phosphorus dose loss due to interface segregation. The total trap density for interface segregation was not affected by implantation damage because silicon implantation did not change the maximum dose loss in samples initially implanted by phosphorus at a high fluence of 2 × 1015 cm-2. However, the shape of phosphorus diffusion profiles was changed with silicon implantation, implying that the implantation damage promoted the diffusion of phosphorus toward surface. The promotion of the diffusion toward surface increased the dose loss in samples with a low initial phosphorus fluence of 7 × 1013 cm-2 because most of the segregation sites at the interface were empty.

Original languageEnglish
Pages (from-to)1-4
Number of pages4
JournalNuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
Volume313
DOIs
StatePublished - 2013

Keywords

  • Dose loss
  • Implantation damage
  • Interface segregation
  • Phosphorus
  • Transient enhanced diffusion

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