TY - GEN
T1 - Effect of Lead-free soldering on key material properties of PR-4 printed circuit board laminates
AU - Sanapala, Ravikumar
AU - Sood, Bhanu
AU - Das, Diganta
AU - Pecht, Michael
AU - Huang, C. Y.
AU - Tsai, M. Y.
PY - 2008
Y1 - 2008
N2 - The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as Sn Ag/Cu has resulted in higher temperature exposures during assembly compared with traditional eutectic Sn/Pb solders. Variations, if any, in laminate material properties before and after board assembly should be considered in the selection of appropriate laminates. This paper provides guidelines for laminate selection that are arrived by assessing key material properties (glass transition temperature (T g), coefficient of thermal expansion (CTE), decomposition temperature (T g), time-to-delamination T-260), and water absorption), and their responses to lead-free soldering assembly conditions. A range of commercially available FR-4 PCB laminate materials, classified on the basis of glass transition temperature (high, mid and low), curing agents (dicyandiamide (DICY) and phenolic), flame retardants (halogenated and halogen-free), and presence of fillers are studied The laminate material properties under investigation are measured in accordance with IPC-TM-650 test standards before and after exposure to multiple lead-free soldering cycles.
AB - The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as Sn Ag/Cu has resulted in higher temperature exposures during assembly compared with traditional eutectic Sn/Pb solders. Variations, if any, in laminate material properties before and after board assembly should be considered in the selection of appropriate laminates. This paper provides guidelines for laminate selection that are arrived by assessing key material properties (glass transition temperature (T g), coefficient of thermal expansion (CTE), decomposition temperature (T g), time-to-delamination T-260), and water absorption), and their responses to lead-free soldering assembly conditions. A range of commercially available FR-4 PCB laminate materials, classified on the basis of glass transition temperature (high, mid and low), curing agents (dicyandiamide (DICY) and phenolic), flame retardants (halogenated and halogen-free), and presence of fillers are studied The laminate material properties under investigation are measured in accordance with IPC-TM-650 test standards before and after exposure to multiple lead-free soldering cycles.
UR - https://www.scopus.com/pages/publications/64049086780
U2 - 10.1109/EMAP.2008.4784262
DO - 10.1109/EMAP.2008.4784262
M3 - 会议稿件
AN - SCOPUS:64049086780
SN - 9781424436217
T3 - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
SP - 195
EP - 199
BT - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
T2 - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Y2 - 22 October 2008 through 24 October 2008
ER -