Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth

Y. D. Han, H. Y. Jing, S. M.L. Nai, L. Y. Xu, C. M. Tan, J. Wei*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

In the present study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix, to form a composite solder. The interfacial intermetallic compound layer thickness formed on electroless nickel immersion gold (ENIG) metallized Cu substrate was determined under the assoldered condition. It was observed that the addition of 0.01 wt.% Ni-CNTs into the Sn-Ag-Cu solder matrix, affected the formation of intermetallic compounds during the soldering reaction. For the reaction between the composite solder and the ENIG/Cu substrate, (Cu1-xNix) 6Sn5 and (Cu1-yNiy) 3Sn4 were formed. The test results revealed that the thickness of interfacial IMC decreased from 2.30 μm to 1.84 μm with the addition of Ni-CNTs. Shear tests were also conducted on the as-soldered solder joints. The shear test results revealed that the composite solder joint exhibited a ∼ 15% increase in yield strength and a ∼ 17% increase in ultimate shear strength, as compared to its monolithic counterpart.

Original languageEnglish
Title of host publicationEPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages292-295
Number of pages4
DOIs
StatePublished - 2009
Externally publishedYes
Event2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore
Duration: 09 12 200911 12 2009

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference2009 11th Electronic Packaging Technology Conference, EPTC 2009
Country/TerritorySingapore
CitySingapore
Period09/12/0911/12/09

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