TY - GEN
T1 - Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder
AU - Han, Y. D.
AU - Tan, C. M.
AU - Nai, S. M.L.
AU - Xu, L. Y.
AU - Jing, H. Y.
AU - Wei, J.
PY - 2010
Y1 - 2010
N2 - In this work, varying weight percentages of Ni-coated CNTs (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix to develop composite solders. The samples were extruded and characterized in terms of their thermal, wettability, microstructural, tensile and nano-mechanical properties. Our characterization results established that the composite technology coupled with nanotechnology in electronic solders can lead to 8% improvement in mechanical performance (in terms of 0.2% yield strength), 12% increase in the ultimate tensile strength and better creep behavior. With the addition of Ni-CNTs, there is no compromise on the melting point of the solder alloy and in fact a better wettability of the nanocomposite solders was observed. Thus, such a Ni-coated CNT filler in Sn-Ag-Cu solder provides a promising interconnect materials for microelectronics assembly and packaging industry.
AB - In this work, varying weight percentages of Ni-coated CNTs (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix to develop composite solders. The samples were extruded and characterized in terms of their thermal, wettability, microstructural, tensile and nano-mechanical properties. Our characterization results established that the composite technology coupled with nanotechnology in electronic solders can lead to 8% improvement in mechanical performance (in terms of 0.2% yield strength), 12% increase in the ultimate tensile strength and better creep behavior. With the addition of Ni-CNTs, there is no compromise on the melting point of the solder alloy and in fact a better wettability of the nanocomposite solders was observed. Thus, such a Ni-coated CNT filler in Sn-Ag-Cu solder provides a promising interconnect materials for microelectronics assembly and packaging industry.
UR - http://www.scopus.com/inward/record.url?scp=77955180809&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2010.5490658
DO - 10.1109/ECTC.2010.5490658
M3 - 会议稿件
AN - SCOPUS:77955180809
SN - 9781424464104
T3 - Proceedings - Electronic Components and Technology Conference
SP - 979
EP - 984
BT - 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
T2 - 60th Electronic Components and Technology Conference, ECTC 2010
Y2 - 1 June 2010 through 4 June 2010
ER -