Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder

Y. D. Han; C. M. Tan; S. M.L. Nai; L. Y. Xu; H. Y. Jing; J. Wei

doi:10.1109/ECTC.2010.5490658

Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder

Y. D. Han
, C. M. Tan
, S. M.L. Nai
, L. Y. Xu
, H. Y. Jing
, J. Wei

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

8 Scopus citations

Abstract

In this work, varying weight percentages of Ni-coated CNTs (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix to develop composite solders. The samples were extruded and characterized in terms of their thermal, wettability, microstructural, tensile and nano-mechanical properties. Our characterization results established that the composite technology coupled with nanotechnology in electronic solders can lead to 8% improvement in mechanical performance (in terms of 0.2% yield strength), 12% increase in the ultimate tensile strength and better creep behavior. With the addition of Ni-CNTs, there is no compromise on the melting point of the solder alloy and in fact a better wettability of the nanocomposite solders was observed. Thus, such a Ni-coated CNT filler in Sn-Ag-Cu solder provides a promising interconnect materials for microelectronics assembly and packaging industry.

Original language	English
Title of host publication	2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
Pages	979-984
Number of pages	6
DOIs	https://doi.org/10.1109/ECTC.2010.5490658
State	Published - 2010
Externally published	Yes
Event	60th Electronic Components and Technology Conference, ECTC 2010 - Las Vegas, NV, United States Duration: 01 06 2010 → 04 06 2010

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	60th Electronic Components and Technology Conference, ECTC 2010
Country/Territory	United States
City	Las Vegas, NV
Period	01/06/10 → 04/06/10

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

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10.1109/ECTC.2010.5490658

Cite this

Han, Y. D., Tan, C. M., Nai, S. M. L., Xu, L. Y., Jing, H. Y., & Wei, J. (2010). Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder. In 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010 (pp. 979-984). Article 5490658 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2010.5490658

@inproceedings{9d6462e88b1b4c29b8e781ddfe50c842,

title = "Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder",

abstract = "In this work, varying weight percentages of Ni-coated CNTs (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix to develop composite solders. The samples were extruded and characterized in terms of their thermal, wettability, microstructural, tensile and nano-mechanical properties. Our characterization results established that the composite technology coupled with nanotechnology in electronic solders can lead to 8\% improvement in mechanical performance (in terms of 0.2\% yield strength), 12\% increase in the ultimate tensile strength and better creep behavior. With the addition of Ni-CNTs, there is no compromise on the melting point of the solder alloy and in fact a better wettability of the nanocomposite solders was observed. Thus, such a Ni-coated CNT filler in Sn-Ag-Cu solder provides a promising interconnect materials for microelectronics assembly and packaging industry.",

author = "Han, \{Y. D.\} and Tan, \{C. M.\} and Nai, \{S. M.L.\} and Xu, \{L. Y.\} and Jing, \{H. Y.\} and J. Wei",

year = "2010",

doi = "10.1109/ECTC.2010.5490658",

language = "英语",

isbn = "9781424464104",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "979--984",

booktitle = "2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010",

note = "60th Electronic Components and Technology Conference, ECTC 2010 ; Conference date: 01-06-2010 Through 04-06-2010",

}

Han, YD, Tan, CM, Nai, SML, Xu, LY, Jing, HY & Wei, J 2010, Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder. in 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010., 5490658, Proceedings - Electronic Components and Technology Conference, pp. 979-984, 60th Electronic Components and Technology Conference, ECTC 2010, Las Vegas, NV, United States, 01/06/10. https://doi.org/10.1109/ECTC.2010.5490658

Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder. / Han, Y. D.; Tan, C. M.; Nai, S. M.L. et al.
2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. 2010. p. 979-984 5490658 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder

AU - Han, Y. D.

AU - Tan, C. M.

AU - Nai, S. M.L.

AU - Xu, L. Y.

AU - Jing, H. Y.

AU - Wei, J.

PY - 2010

Y1 - 2010

N2 - In this work, varying weight percentages of Ni-coated CNTs (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix to develop composite solders. The samples were extruded and characterized in terms of their thermal, wettability, microstructural, tensile and nano-mechanical properties. Our characterization results established that the composite technology coupled with nanotechnology in electronic solders can lead to 8% improvement in mechanical performance (in terms of 0.2% yield strength), 12% increase in the ultimate tensile strength and better creep behavior. With the addition of Ni-CNTs, there is no compromise on the melting point of the solder alloy and in fact a better wettability of the nanocomposite solders was observed. Thus, such a Ni-coated CNT filler in Sn-Ag-Cu solder provides a promising interconnect materials for microelectronics assembly and packaging industry.

AB - In this work, varying weight percentages of Ni-coated CNTs (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix to develop composite solders. The samples were extruded and characterized in terms of their thermal, wettability, microstructural, tensile and nano-mechanical properties. Our characterization results established that the composite technology coupled with nanotechnology in electronic solders can lead to 8% improvement in mechanical performance (in terms of 0.2% yield strength), 12% increase in the ultimate tensile strength and better creep behavior. With the addition of Ni-CNTs, there is no compromise on the melting point of the solder alloy and in fact a better wettability of the nanocomposite solders was observed. Thus, such a Ni-coated CNT filler in Sn-Ag-Cu solder provides a promising interconnect materials for microelectronics assembly and packaging industry.

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M3 - 会议稿件

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SN - 9781424464104

T3 - Proceedings - Electronic Components and Technology Conference

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BT - 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010

T2 - 60th Electronic Components and Technology Conference, ECTC 2010

Y2 - 1 June 2010 through 4 June 2010

ER -

Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder

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