Effect of the AlGaN/GaN Schottky barrier diodes combined with a dual anode metal and a p-GaN layer on reverse breakdown and turn-on voltage

Kuang Po Hsueh, Yi Sheng Chang, Bo Hong Li, Hsiang Chun Wang, Hsien Chin Chiu*, Chih Wei Hu, Rong Xuan

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

18 Scopus citations

Abstract

AlGaN/GaN Schottky barrier diodes (SBDs) combined with a dual anode metal (ohmic and Schottky contacts) and a p-GaN layer were studied for improving the reverse breakdown voltage (VBR) and reducing the turn-on voltage (VON). Structures with various distances of p-GaN layer (LG) were investigated using the current-voltage (I–V), reverse recovery time, and voltage stress characteristics. The SBDs fabricated with LG = 3 µm realized a lower RON of 4.26 mΩ-cm2 and lower VON of 0.10 V compared with the SBDs fabricated with LG = 5 and 8 µm as well as the standard device. Moreover, the VBR of the SBDs with LG = 3, 5, and 8 µm was − 606, − 679, and − 713 V, respectively. The results indicated that the SBDs combined with a dual anode metal and a p-GaN layer have significantly improved VBR than does of standard device. The reverse recovery time and reverse recovery charge of the SBD combined with a dual anode metal and a p-GaN layer design decreased due to the low noise and traps from the p-n junction.

Original languageEnglish
Pages (from-to)107-111
Number of pages5
JournalMaterials Science in Semiconductor Processing
Volume90
DOIs
StatePublished - 02 2019

Bibliographical note

Publisher Copyright:
© 2018 Elsevier Ltd

Keywords

  • AlGaN
  • Dual anode metal
  • P-GaN
  • Reverse recovery time
  • Schottky barrier diode

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