| Translated title of the contribution | 三維堆疊積體電路晶片之矽穿孔結構應力對載子遷移率及晶片強度之影響 |
|---|---|
| Original language | American English |
| Supervisors/Advisors |
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| State | Published - 2014 |
| Externally published | Yes |
Effect of TSV-Induced Stresses on Carrier Mobility and Strength of 3-D IC Chips
黃溥膳
Research output: Types of Thesis › Doctoral thesis