Effect of ULSI interconnect layout on its Electromagnetic Emission

Cher Ming Tan; Dipesh Kapoor; Vivek Sagawan

doi:10.1109/ICSICT.2016.7998965

Effect of ULSI interconnect layout on its Electromagnetic Emission

Cher Ming Tan, Dipesh Kapoor, Vivek Sagawan

Department of Electronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

In this work, a modeling method is developed so that one can investigate the Electromagnetic Emission (EME) of different interconnection layouts in integrated circuit through simulation. We examine the near field EME from different interconnect layouts for input signal of various frequencies and amplitude of 1V, and we found that the layout indeed affects the EME performances of an integrated circuit. In some cases, it will not be able to pass the CISPR-25 standards for narrow and broad band requirements, but with a small change in the layout such as moving a ground trace from bottom to the top of an interconnect, it can then satisfy the CISPR-25 standards. The electric field distributions of interconnect structures are also presented and one is able to locate the maximum electric field and thus modification of the layout can be made possible.

Original language	English
Title of host publication	2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings
Editors	Yu-Long Jiang, Ting-Ao Tang, Ru Huang
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	512-515
Number of pages	4
ISBN (Electronic)	9781467397179
DOIs	https://doi.org/10.1109/ICSICT.2016.7998965
State	Published - 2016
Event	13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Hangzhou, China Duration: 25 10 2016 → 28 10 2016

Publication series

Name	2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings

Conference

Conference	13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016
Country/Territory	China
City	Hangzhou
Period	25/10/16 → 28/10/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

Access to Document

10.1109/ICSICT.2016.7998965

Cite this

Tan, C. M., Kapoor, D., & Sagawan, V. (2016). Effect of ULSI interconnect layout on its Electromagnetic Emission. In Y.-L. Jiang, T.-A. Tang, & R. Huang (Eds.), 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings (pp. 512-515). Article 7998965 (2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSICT.2016.7998965

Tan, Cher Ming ; Kapoor, Dipesh ; Sagawan, Vivek. / Effect of ULSI interconnect layout on its Electromagnetic Emission. 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings. editor / Yu-Long Jiang ; Ting-Ao Tang ; Ru Huang. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 512-515 (2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings).

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title = "Effect of ULSI interconnect layout on its Electromagnetic Emission",

abstract = "In this work, a modeling method is developed so that one can investigate the Electromagnetic Emission (EME) of different interconnection layouts in integrated circuit through simulation. We examine the near field EME from different interconnect layouts for input signal of various frequencies and amplitude of 1V, and we found that the layout indeed affects the EME performances of an integrated circuit. In some cases, it will not be able to pass the CISPR-25 standards for narrow and broad band requirements, but with a small change in the layout such as moving a ground trace from bottom to the top of an interconnect, it can then satisfy the CISPR-25 standards. The electric field distributions of interconnect structures are also presented and one is able to locate the maximum electric field and thus modification of the layout can be made possible.",

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year = "2016",

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series = "2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings",

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Tan, CM, Kapoor, D & Sagawan, V 2016, Effect of ULSI interconnect layout on its Electromagnetic Emission. in Y-L Jiang, T-A Tang & R Huang (eds), 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings., 7998965, 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 512-515, 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016, Hangzhou, China, 25/10/16. https://doi.org/10.1109/ICSICT.2016.7998965

Effect of ULSI interconnect layout on its Electromagnetic Emission. / Tan, Cher Ming; Kapoor, Dipesh; Sagawan, Vivek.
2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings. ed. / Yu-Long Jiang; Ting-Ao Tang; Ru Huang. Institute of Electrical and Electronics Engineers Inc., 2016. p. 512-515 7998965 (2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - In this work, a modeling method is developed so that one can investigate the Electromagnetic Emission (EME) of different interconnection layouts in integrated circuit through simulation. We examine the near field EME from different interconnect layouts for input signal of various frequencies and amplitude of 1V, and we found that the layout indeed affects the EME performances of an integrated circuit. In some cases, it will not be able to pass the CISPR-25 standards for narrow and broad band requirements, but with a small change in the layout such as moving a ground trace from bottom to the top of an interconnect, it can then satisfy the CISPR-25 standards. The electric field distributions of interconnect structures are also presented and one is able to locate the maximum electric field and thus modification of the layout can be made possible.

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Tan CM, Kapoor D, Sagawan V. Effect of ULSI interconnect layout on its Electromagnetic Emission. In Jiang YL, Tang TA, Huang R, editors, 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2016. p. 512-515. 7998965. (2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings). doi: 10.1109/ICSICT.2016.7998965

Effect of ULSI interconnect layout on its Electromagnetic Emission

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