Effectiveness of ΔVF test to detect solder integrity in power diode

Cher Ming Tan; Zhenghao Gan

doi:10.1109/PEDS.2003.1282673

Effectiveness of ΔV_F test to detect solder integrity in power diode

Cher Ming Tan^*, Zhenghao Gan

^*Corresponding author for this work

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

ΔV_F test is a common electrical test in power diode industry for the evaluation of the integrity of solder contact between the leads and the dice. Whereas the test is effective to detect devices with voids in solder, it is found that the test is not possible to detect devices with solder under-coverage. A finite element (FE) analysis is performed to understand the effect of solder under-coverage on the thermal resistance. Both the simulation results and the experimental results will be shown in this work. A novel method to detect the solder under-coverage will be presented, and the results will be shown.

Original language	English
Title of host publication	5th International Conference on Power Electronics and Drive Systems, PEDS 2003 - Proceedings
Editors	King-Jet Tseng
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	38-42
Number of pages	5
ISBN (Electronic)	0780378857
DOIs	https://doi.org/10.1109/PEDS.2003.1282673
State	Published - 2003
Externally published	Yes
Event	5th International Conference on Power Electronics and Drive Systems, PEDS 2003 - Singapore, Singapore Duration: 17 11 2003 → 20 11 2003

Publication series

Name	Proceedings of the International Conference on Power Electronics and Drive Systems
Volume	1

Conference

Conference	5th International Conference on Power Electronics and Drive Systems, PEDS 2003
Country/Territory	Singapore
City	Singapore
Period	17/11/03 → 20/11/03

Bibliographical note

Publisher Copyright:
© 2003 IEEE.

Keywords

Power diode
electrical resistance
finite element analysis
solder under-coverage
thermal resistance

Access to Document

10.1109/PEDS.2003.1282673

Cite this

Tan, C. M., & Gan, Z. (2003). Effectiveness of ΔV_F test to detect solder integrity in power diode. In K.-J. Tseng (Ed.), 5th International Conference on Power Electronics and Drive Systems, PEDS 2003 - Proceedings (pp. 38-42). Article 1282673 (Proceedings of the International Conference on Power Electronics and Drive Systems; Vol. 1). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PEDS.2003.1282673

Tan, Cher Ming ; Gan, Zhenghao. / Effectiveness of ΔV_F test to detect solder integrity in power diode. 5th International Conference on Power Electronics and Drive Systems, PEDS 2003 - Proceedings. editor / King-Jet Tseng. Institute of Electrical and Electronics Engineers Inc., 2003. pp. 38-42 (Proceedings of the International Conference on Power Electronics and Drive Systems).

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title = "Effectiveness of ΔVF test to detect solder integrity in power diode",

abstract = "ΔVF test is a common electrical test in power diode industry for the evaluation of the integrity of solder contact between the leads and the dice. Whereas the test is effective to detect devices with voids in solder, it is found that the test is not possible to detect devices with solder under-coverage. A finite element (FE) analysis is performed to understand the effect of solder under-coverage on the thermal resistance. Both the simulation results and the experimental results will be shown in this work. A novel method to detect the solder under-coverage will be presented, and the results will be shown.",

keywords = "Power diode, electrical resistance, finite element analysis, solder under-coverage, thermal resistance",

author = "Tan, {Cher Ming} and Zhenghao Gan",

note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 5th International Conference on Power Electronics and Drive Systems, PEDS 2003 ; Conference date: 17-11-2003 Through 20-11-2003",

year = "2003",

doi = "10.1109/PEDS.2003.1282673",

language = "英语",

series = "Proceedings of the International Conference on Power Electronics and Drive Systems",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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Tan, CM & Gan, Z 2003, Effectiveness of ΔV_F test to detect solder integrity in power diode. in K-J Tseng (ed.), 5th International Conference on Power Electronics and Drive Systems, PEDS 2003 - Proceedings., 1282673, Proceedings of the International Conference on Power Electronics and Drive Systems, vol. 1, Institute of Electrical and Electronics Engineers Inc., pp. 38-42, 5th International Conference on Power Electronics and Drive Systems, PEDS 2003, Singapore, Singapore, 17/11/03. https://doi.org/10.1109/PEDS.2003.1282673

Effectiveness of ΔV_F test to detect solder integrity in power diode. / Tan, Cher Ming; Gan, Zhenghao.
5th International Conference on Power Electronics and Drive Systems, PEDS 2003 - Proceedings. ed. / King-Jet Tseng. Institute of Electrical and Electronics Engineers Inc., 2003. p. 38-42 1282673 (Proceedings of the International Conference on Power Electronics and Drive Systems; Vol. 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - ΔVF test is a common electrical test in power diode industry for the evaluation of the integrity of solder contact between the leads and the dice. Whereas the test is effective to detect devices with voids in solder, it is found that the test is not possible to detect devices with solder under-coverage. A finite element (FE) analysis is performed to understand the effect of solder under-coverage on the thermal resistance. Both the simulation results and the experimental results will be shown in this work. A novel method to detect the solder under-coverage will be presented, and the results will be shown.

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Tan CM, Gan Z. Effectiveness of ΔV_F test to detect solder integrity in power diode. In Tseng KJ, editor, 5th International Conference on Power Electronics and Drive Systems, PEDS 2003 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2003. p. 38-42. 1282673. (Proceedings of the International Conference on Power Electronics and Drive Systems). doi: 10.1109/PEDS.2003.1282673