Effects of nitric-oxide-plasma treatment on the electrical properties of tetraethylorthosilicate-deposited silicon dioxides on strained-Si1-xGex layers

  • B. Senapati
  • , S. K. Samanta
  • , S. Maikap
  • , L. K. Bera
  • , C. K. Maiti*
  • *Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

11 Scopus citations

Abstract

Gate-quality ultrathin silicon dioxide films on strained-Si0.74Ge0.26 layers have been deposited by microwave plasma-enhanced chemical vapor deposition technique using tetraethylorthosilicate. Effect of nitric-oxide (NO)-plasma treatment on the electrical properties of the deposited oxides have been studied using a metal-insulator-semiconductor structure. A significant improvement in the interface trap level density (Dit) and charge trapping behavior under Fowler-Nordheim constant current stressing is observed for NO-plasma treated deposited oxide films.

Original languageEnglish
Pages (from-to)1840-1842
Number of pages3
JournalApplied Physics Letters
Volume77
Issue number12
DOIs
StatePublished - 18 09 2000
Externally publishedYes

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