@inproceedings{e895f563bbab4303894efa8fe0b08b88,
title = "Effects of some parameters on warpage and bump-joint stresses of COG packages",
abstract = "Various parameters such as thermal loads, adhesive material properties, and fillets, that affect the warpage and bump joint stresses of the chip-on-glass (COG) packages, are discussed. Two and three dimensional finite element models are employed for calculating the warpage and bump- joint stresses in term of such parameters. The real-time full-field Twyman-Green interferometry is used for measuring the out-of-plane deformations of the specimens and providing validation of the warpage calculated from finite element models. It is shown that the fillets strongly affect the warpage of the COG specimens by changing the convex shape of warpage for those without fillets to the saddle shape for those with fillets.",
author = "Tsai, \{M. Y.\} and Wu, \{C. Y.\} and Huang, \{C. W.\} and Cheng, \{W. C.\} and Kong, \{S. R.\} and Yang, \{S. S.\} and Chang, \{S. M.\}",
year = "2004",
language = "英语",
isbn = "0780387449",
series = "2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics",
pages = "182--190",
booktitle = "2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics",
note = "2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics ; Conference date: 12-09-2004 Through 15-09-2004",
}