Electrodeposition of a protective copper/nickel deposit on the magnesium alloy (AZ31)

C. A. Huang; T. H. Wang; T. Weirich; V. Neubert

doi:10.1016/j.corsci.2007.12.004

Electrodeposition of a protective copper/nickel deposit on the magnesium alloy (AZ31)

C. A. Huang^*, T. H. Wang, T. Weirich, V. Neubert

^*Corresponding author for this work

Department of Mechanical Engineering

Research output: Contribution to journal › Journal Article › peer-review

61 Scopus citations

Abstract

An environmental-friendly Cu electrodeposition process was proposed for the Magnesium alloy (AZ 31). Experimental results show that a good bonding between Cu deposit and Mg alloy surface can be achieved with a pretreatment of galvanostatic etching and then copper electrodeposition in the alkaline copper-sulfate plating bath. Microstructures between Cu deposit and Mg alloy substrate were examined with scanning electron and energy-filtering transmission electron microscopes (SEM and EF-TEM). The Cu-deposited Mg alloy can be further electroplated in acidic Cu and Ni plating baths to acquire a protective Cu/Ni deposit.

Original language	English
Pages (from-to)	1385-1390
Number of pages	6
Journal	Corrosion Science
Volume	50
Issue number	5
DOIs	https://doi.org/10.1016/j.corsci.2007.12.004
State	Published - 05 2008

Keywords

A. Magnesium
B. EF-TEM
B. Galvanostatic etching
B. SEM

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10.1016/j.corsci.2007.12.004

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title = "Electrodeposition of a protective copper/nickel deposit on the magnesium alloy (AZ31)",

abstract = "An environmental-friendly Cu electrodeposition process was proposed for the Magnesium alloy (AZ 31). Experimental results show that a good bonding between Cu deposit and Mg alloy surface can be achieved with a pretreatment of galvanostatic etching and then copper electrodeposition in the alkaline copper-sulfate plating bath. Microstructures between Cu deposit and Mg alloy substrate were examined with scanning electron and energy-filtering transmission electron microscopes (SEM and EF-TEM). The Cu-deposited Mg alloy can be further electroplated in acidic Cu and Ni plating baths to acquire a protective Cu/Ni deposit.",

keywords = "A. Magnesium, B. EF-TEM, B. Galvanostatic etching, B. SEM",

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T1 - Electrodeposition of a protective copper/nickel deposit on the magnesium alloy (AZ31)

AU - Huang, C. A.

AU - Wang, T. H.

AU - Weirich, T.

AU - Neubert, V.

PY - 2008/5

Y1 - 2008/5

N2 - An environmental-friendly Cu electrodeposition process was proposed for the Magnesium alloy (AZ 31). Experimental results show that a good bonding between Cu deposit and Mg alloy surface can be achieved with a pretreatment of galvanostatic etching and then copper electrodeposition in the alkaline copper-sulfate plating bath. Microstructures between Cu deposit and Mg alloy substrate were examined with scanning electron and energy-filtering transmission electron microscopes (SEM and EF-TEM). The Cu-deposited Mg alloy can be further electroplated in acidic Cu and Ni plating baths to acquire a protective Cu/Ni deposit.

AB - An environmental-friendly Cu electrodeposition process was proposed for the Magnesium alloy (AZ 31). Experimental results show that a good bonding between Cu deposit and Mg alloy surface can be achieved with a pretreatment of galvanostatic etching and then copper electrodeposition in the alkaline copper-sulfate plating bath. Microstructures between Cu deposit and Mg alloy substrate were examined with scanning electron and energy-filtering transmission electron microscopes (SEM and EF-TEM). The Cu-deposited Mg alloy can be further electroplated in acidic Cu and Ni plating baths to acquire a protective Cu/Ni deposit.

KW - A. Magnesium

KW - B. EF-TEM

KW - B. Galvanostatic etching

KW - B. SEM

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DO - 10.1016/j.corsci.2007.12.004

M3 - 文章

AN - SCOPUS:42049114872

SN - 0010-938X

VL - 50

SP - 1385

EP - 1390

JO - Corrosion Science

JF - Corrosion Science

IS - 5

ER -

Electrodeposition of a protective copper/nickel deposit on the magnesium alloy (AZ31)

Abstract

Keywords

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