Electrodeposition of a protective copper/nickel deposit on the magnesium alloy (AZ31)

C. A. Huang*, T. H. Wang, T. Weirich, V. Neubert

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

60 Scopus citations

Abstract

An environmental-friendly Cu electrodeposition process was proposed for the Magnesium alloy (AZ 31). Experimental results show that a good bonding between Cu deposit and Mg alloy surface can be achieved with a pretreatment of galvanostatic etching and then copper electrodeposition in the alkaline copper-sulfate plating bath. Microstructures between Cu deposit and Mg alloy substrate were examined with scanning electron and energy-filtering transmission electron microscopes (SEM and EF-TEM). The Cu-deposited Mg alloy can be further electroplated in acidic Cu and Ni plating baths to acquire a protective Cu/Ni deposit.

Original languageEnglish
Pages (from-to)1385-1390
Number of pages6
JournalCorrosion Science
Volume50
Issue number5
DOIs
StatePublished - 05 2008

Keywords

  • A. Magnesium
  • B. EF-TEM
  • B. Galvanostatic etching
  • B. SEM

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