EMC-driven placement for MCM

Wu shiung Feng*, Yaw hua Tseng

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

In this paper, we use the hierarchical placement algorithm to implement the EMC-driven MCM placement. To ensure that every maximal connection chip pairs would be placed as close as possible, we provide an clustering development algorithm. A proper model for EMC-driven MCM placement is used in this work. By this model, we use the short wire antenna to simulate the radiation of each chip on the substrate. At present, we have implemented an MCM placement program successfully, and this program can output the layout with the CIF form.

Original languageEnglish
Pages (from-to)364-367
Number of pages4
JournalIEEE International Symposium on Electromagnetic Compatibility
StatePublished - 1997
Externally publishedYes
EventProceedings of the 1997 International Symposium on Electromagnetic Compatibility, EMC - Beijing, China
Duration: 21 05 199723 05 1997

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