Enhanced finite element modelling of Cu electromigration using ANSYS and matlab

Wei Li; Cher Ming Tan

doi:10.1016/j.microrel.2007.07.058

Enhanced finite element modelling of Cu electromigration using ANSYS and matlab

Wei Li, Cher Ming Tan^*

^*Corresponding author for this work

Research output: Contribution to journal › Journal Article › peer-review

10 Scopus citations

Abstract

An enhanced finite element modeling methodology based on commercial software ANSYS Multi-physics and Matlab is developed for the study of electromigration. Various driving forces, namely electron wind force migration (EWM), thermomechanical stress gradient induced migration (SM) and temperature gradient induced migration (TM) are simulated and the resulting atomic flux of metal atoms is calculated based on a non-standard use of ANSYS static thermal analysis routine. An automatic link between ANSYS and Matlab is developed to enhance the capability of ANSYS data postprocessing module in the calculation of atomic flux divergence (AFD). The simulation of a polycrystalline Cu thin film identifies a new potential EM reliability hazard in Cu interconnects which agrees well with experimental observations.

Original language	English
Pages (from-to)	1497-1501
Number of pages	5
Journal	Microelectronics Reliability
Volume	47
Issue number	9-11 SPEC. ISS.
DOIs	https://doi.org/10.1016/j.microrel.2007.07.058
State	Published - 08 2007
Externally published	Yes

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10.1016/j.microrel.2007.07.058

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title = "Enhanced finite element modelling of Cu electromigration using ANSYS and matlab",

abstract = "An enhanced finite element modeling methodology based on commercial software ANSYS Multi-physics and Matlab is developed for the study of electromigration. Various driving forces, namely electron wind force migration (EWM), thermomechanical stress gradient induced migration (SM) and temperature gradient induced migration (TM) are simulated and the resulting atomic flux of metal atoms is calculated based on a non-standard use of ANSYS static thermal analysis routine. An automatic link between ANSYS and Matlab is developed to enhance the capability of ANSYS data postprocessing module in the calculation of atomic flux divergence (AFD). The simulation of a polycrystalline Cu thin film identifies a new potential EM reliability hazard in Cu interconnects which agrees well with experimental observations.",

author = "Wei Li and Tan, {Cher Ming}",

year = "2007",

month = aug,

doi = "10.1016/j.microrel.2007.07.058",

language = "英语",

volume = "47",

pages = "1497--1501",

journal = "Microelectronics Reliability",

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AU - Li, Wei

AU - Tan, Cher Ming

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AB - An enhanced finite element modeling methodology based on commercial software ANSYS Multi-physics and Matlab is developed for the study of electromigration. Various driving forces, namely electron wind force migration (EWM), thermomechanical stress gradient induced migration (SM) and temperature gradient induced migration (TM) are simulated and the resulting atomic flux of metal atoms is calculated based on a non-standard use of ANSYS static thermal analysis routine. An automatic link between ANSYS and Matlab is developed to enhance the capability of ANSYS data postprocessing module in the calculation of atomic flux divergence (AFD). The simulation of a polycrystalline Cu thin film identifies a new potential EM reliability hazard in Cu interconnects which agrees well with experimental observations.

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DO - 10.1016/j.microrel.2007.07.058

M3 - 文章

AN - SCOPUS:34548789072

SN - 0026-2714

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SP - 1497

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JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 9-11 SPEC. ISS.

ER -

Enhanced finite element modelling of Cu electromigration using ANSYS and matlab

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