Enhanced flash memory device characteristics using ALD TiN/Al 2O3 nanolaminate charge storage layers

S. Maikap*, S. Z. Rahaman, W. Banerjee, C. H. Lin, P. J. Tzeng, C. C. Wang, M. J. Kao, M. J. Tsai

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Enhanced flash memory device characteristics using ALD TiN/Al 2O3 nanolaminate charge storage layers have been investigated. After annealing treatment, the TiN nanocrystals embedded in A12O3 films with a small diameter of ∼3 nm and a high-density of >l×1012/cm2 have been formed. The memory devices show a high programming speed of ⇐Vt >1V@Vg/Vd=8V/8V, 10 ≥s and an erasing speed of ⇐Vt >1V@vg/vd=-12V/0V, 1ms. The memory window is increased (⇐Vt >6.7V) with increasing the operation voltage. The memory window is also increased with increasing the number of TiN/Al2O3 nanolaminate layers. Good endurance (10 4 cycles) and retention (charge loss of ∼14% at 20°C and ∼17% at 85°C after 10 years) characteristics of the TiN nanocrystal memory devices can be explained by both of the high-density and layer-by-layer charge storage in the TiN nanocrystals. This novel nanocrystal memory structure can be useful in future nanoscale flash memory device applications.

Original languageEnglish
Title of host publicationICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings
Pages958-961
Number of pages4
DOIs
StatePublished - 2008
Event2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008 - Beijing, China
Duration: 20 10 200823 10 2008

Publication series

NameInternational Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT

Conference

Conference2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008
Country/TerritoryChina
CityBeijing
Period20/10/0823/10/08

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