Enhanced hole mobilities in tensile-strained Si1-yCy alloy PMOSFETs

E. Quinones*, S. K. Ray, K. C. Liu, S. Banerjee

*Corresponding author for this work

Research output: Contribution to conferenceConference Paperpeer-review

Abstract

The fabrication and transport properties of PMOSFETs utilizing a strained-engineered Si1-yCy channel are reported. Epitaxial layers of Si1-yCy were grown on low-doped, 1015 cm-3, n-type Si substrates by ultrahigh vacuum chemical vapor deposition at 500 °C using Si2H6 and CH3SiH3. PH3 was used as an in situ source for n-type doping. X-ray diffraction rocking curves of Si(004) plane for a tensile-strained film demonstrate the role of carbon in the strain engineering of the alloys. Atomic force microscopy shows that the addition of small amounts of carbon does not result in increased surface roughness. PMOSFETs using tensile-strained Si1-yCy channel layers on Si provide drive current enhancement over Si epitaxial channel layers.

Original languageEnglish
Pages182-183
Number of pages2
StatePublished - 1999
Externally publishedYes
EventProceedings of the 1999 57th Annual Device Research Conference Digest (DRC) - Santa Barbara, CA, USA
Duration: 28 06 199930 06 1999

Conference

ConferenceProceedings of the 1999 57th Annual Device Research Conference Digest (DRC)
CitySanta Barbara, CA, USA
Period28/06/9930/06/99

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