Epoxy Molding Compound Lead Frames with Silicone Resin for Encapsulating AlGaN-Based UVB Light-Emitting Diodes

Tsung Yen Liu; Shih Ming Huang; Mu Jen Lai; Rui Sen Liu; Yi Tsung Chang; Wen Hong Sun; Ray Ming Lin

doi:10.1109/ACCESS.2021.3111258

Epoxy Molding Compound Lead Frames with Silicone Resin for Encapsulating AlGaN-Based UVB Light-Emitting Diodes

Tsung Yen Liu, Shih Ming Huang, Mu Jen Lai, Rui Sen Liu, Yi Tsung Chang, Wen Hong Sun, Ray Ming Lin^*

^*Corresponding author for this work

Department of Electronic Engineering

Research output: Contribution to journal › Journal Article › peer-review

4 Scopus citations

Abstract

In this paper we report epoxy molding compound lead frames (EMC-LFs) with encapsulated silicone as a simple and inexpensive packaging for AlGaN-based ultraviolet-B (UVB) light-emitting diodes (LEDs) displaying high light extracting efficiencies (LEE) and long operation lifetimes. The convex surfaces and beveled shapes obtained after curing the encapsulated silicone surrounding the UVB-LED chips significantly enhanced the light output power (LOP). With silicone present inside the EMC-LFs having bonding cavity diameters of 1.7 and 1.45 mm, the LOPs of the UVB-LEDs improved by 26 and 42%, respectively; reliability tests performed over a period of 1000 h revealed, however, that the LOPs decreased to 70 and 71%, respectively, of their initial values, but no cracks appeared in the silicone during such long-term operation. Thus, the stability of silicone-encapsulating EMC-LFs for UVB-LEDs was acceptable. When compared with AlN-based direct plating copper ceramic lead frames (AlN-DPC-LFs), our proposed packaging structure and method have the potential to lower the manufacturing cost of UVB-LEDs.

Original language	English
Pages (from-to)	129874-129880
Number of pages	7
Journal	IEEE Access
Volume	9
DOIs	https://doi.org/10.1109/ACCESS.2021.3111258
State	Published - 2021

Bibliographical note

Publisher Copyright:
© 2013 IEEE.

Keywords

AlGaN
AlGaN-based ultraviolet-B LEDs
light output power
packaging

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10.1109/ACCESS.2021.3111258

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@article{710b9dc0776a437bbb2b2e2310a8dcad,

title = "Epoxy Molding Compound Lead Frames with Silicone Resin for Encapsulating AlGaN-Based UVB Light-Emitting Diodes",

abstract = "In this paper we report epoxy molding compound lead frames (EMC-LFs) with encapsulated silicone as a simple and inexpensive packaging for AlGaN-based ultraviolet-B (UVB) light-emitting diodes (LEDs) displaying high light extracting efficiencies (LEE) and long operation lifetimes. The convex surfaces and beveled shapes obtained after curing the encapsulated silicone surrounding the UVB-LED chips significantly enhanced the light output power (LOP). With silicone present inside the EMC-LFs having bonding cavity diameters of 1.7 and 1.45 mm, the LOPs of the UVB-LEDs improved by 26 and 42%, respectively; reliability tests performed over a period of 1000 h revealed, however, that the LOPs decreased to 70 and 71%, respectively, of their initial values, but no cracks appeared in the silicone during such long-term operation. Thus, the stability of silicone-encapsulating EMC-LFs for UVB-LEDs was acceptable. When compared with AlN-based direct plating copper ceramic lead frames (AlN-DPC-LFs), our proposed packaging structure and method have the potential to lower the manufacturing cost of UVB-LEDs.",

keywords = "AlGaN, AlGaN-based ultraviolet-B LEDs, light output power, packaging",

author = "Liu, {Tsung Yen} and Huang, {Shih Ming} and Lai, {Mu Jen} and Liu, {Rui Sen} and Chang, {Yi Tsung} and Sun, {Wen Hong} and Lin, {Ray Ming}",

note = "Publisher Copyright: {\textcopyright} 2013 IEEE.",

year = "2021",

doi = "10.1109/ACCESS.2021.3111258",

language = "英语",

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AU - Liu, Tsung Yen

AU - Huang, Shih Ming

AU - Lai, Mu Jen

AU - Liu, Rui Sen

AU - Chang, Yi Tsung

AU - Sun, Wen Hong

AU - Lin, Ray Ming

PY - 2021

Y1 - 2021

N2 - In this paper we report epoxy molding compound lead frames (EMC-LFs) with encapsulated silicone as a simple and inexpensive packaging for AlGaN-based ultraviolet-B (UVB) light-emitting diodes (LEDs) displaying high light extracting efficiencies (LEE) and long operation lifetimes. The convex surfaces and beveled shapes obtained after curing the encapsulated silicone surrounding the UVB-LED chips significantly enhanced the light output power (LOP). With silicone present inside the EMC-LFs having bonding cavity diameters of 1.7 and 1.45 mm, the LOPs of the UVB-LEDs improved by 26 and 42%, respectively; reliability tests performed over a period of 1000 h revealed, however, that the LOPs decreased to 70 and 71%, respectively, of their initial values, but no cracks appeared in the silicone during such long-term operation. Thus, the stability of silicone-encapsulating EMC-LFs for UVB-LEDs was acceptable. When compared with AlN-based direct plating copper ceramic lead frames (AlN-DPC-LFs), our proposed packaging structure and method have the potential to lower the manufacturing cost of UVB-LEDs.

AB - In this paper we report epoxy molding compound lead frames (EMC-LFs) with encapsulated silicone as a simple and inexpensive packaging for AlGaN-based ultraviolet-B (UVB) light-emitting diodes (LEDs) displaying high light extracting efficiencies (LEE) and long operation lifetimes. The convex surfaces and beveled shapes obtained after curing the encapsulated silicone surrounding the UVB-LED chips significantly enhanced the light output power (LOP). With silicone present inside the EMC-LFs having bonding cavity diameters of 1.7 and 1.45 mm, the LOPs of the UVB-LEDs improved by 26 and 42%, respectively; reliability tests performed over a period of 1000 h revealed, however, that the LOPs decreased to 70 and 71%, respectively, of their initial values, but no cracks appeared in the silicone during such long-term operation. Thus, the stability of silicone-encapsulating EMC-LFs for UVB-LEDs was acceptable. When compared with AlN-based direct plating copper ceramic lead frames (AlN-DPC-LFs), our proposed packaging structure and method have the potential to lower the manufacturing cost of UVB-LEDs.

KW - AlGaN

KW - AlGaN-based ultraviolet-B LEDs

KW - light output power

KW - packaging

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DO - 10.1109/ACCESS.2021.3111258

M3 - 文章

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SN - 2169-3536

VL - 9

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JO - IEEE Access

JF - IEEE Access

ER -

Epoxy Molding Compound Lead Frames with Silicone Resin for Encapsulating AlGaN-Based UVB Light-Emitting Diodes

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