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Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity
Ming Yi Tsai*, P. S. Huang, J. H. Yeh, H. Y. Liu, Y. C. Chao, Fila Tsai, D. L. Chen, M. K. Shih, David Tarng
*Corresponding author for this work
Research output: Contribution to journal › Journal Article › peer-review