Experimental and numerical studies of warpages of ACF-bonded COG packages induced from manufacturing and thermal cycling

  • Ming Yi Tsai*
  • , Chen Yu Huang
  • , Chih Yao Chiang
  • , Wen Chin Chen
  • , Sheng Shu Yang
    • *Corresponding author for this work

Research output: Contribution to journal › Journal Article › peer-review

12 Scopus citations

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