Experimental study of evaporation resistance on porous surfaces in flat heat pipes

Liang Han Chien; C. C. Chang

doi:10.1109/ITHERM.2002.1012463

Experimental study of evaporation resistance on porous surfaces in flat heat pipes

Liang Han Chien, C. C. Chang

Department of Mechanical Engineering

Chang Gung University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

13 Scopus citations

Abstract

This experimental study investigated the effect of particle size and coating thickness of the porous surface on evaporator thermal resistance of a thermosyphon having a 16 mm diameter circular heating area. Copper particles having two kinds of size distributions were sintered on a copper plate. The two particle distributions were 115 μm average diameter in the range 50 to 500 μm, and 247 μm average diameter in the range 180 to 350 μm. The particle coating thickness was either 0.5 or 1.0 mm for each distribution. Water was used as the working fluid, and it was tested at 60 or 70°C saturation temperature, which corresponds to sub-atmospheric saturation pressure. The heat flux varied between 30 and 550 kW/m². The boiling surfaces were tested in vertical and horizontal orientations, and the experimental results showed negligible effect on the surface orientation. The best boiling surface in the present study is obtained with a coating 1.0 mm thick and 247 μm average particle diameter. At 70°C this surface yielded less than 0.025 K/W evaporation thermal resistance at 93 W.

Original language	English
Title of host publication	ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Editors	Bahgat G. Sammakia, Yogendra K. Joshi, Ganesh Subbarayan, Cristina H. Amon, Koneru Ramakrishna, Sanjeev B. Sathe
Publisher	IEEE Computer Society
Pages	236-242
Number of pages	7
ISBN (Electronic)	0780371526
DOIs	https://doi.org/10.1109/ITHERM.2002.1012463
State	Published - 2002
Event	8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, United States Duration: 30 05 2002 → 01 06 2002

Publication series

Name	InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume	2002-January
ISSN (Print)	1936-3958

Conference

Conference	8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
Country/Territory	United States
City	San Diego
Period	30/05/02 → 01/06/02

Bibliographical note

Publisher Copyright:
© 2002 IEEE.

Keywords

Coatings
Electronics cooling
Heat sinks
Heat transfer
Resistance heating
Surface resistance
Temperature
Testing
Thermal conductivity
Thermal resistance

Access to Document

10.1109/ITHERM.2002.1012463

Cite this

Chien, L. H., & Chang, C. C. (2002). Experimental study of evaporation resistance on porous surfaces in flat heat pipes. In B. G. Sammakia, Y. K. Joshi, G. Subbarayan, C. H. Amon, K. Ramakrishna, & S. B. Sathe (Eds.), ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (pp. 236-242). Article 1012463 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2002-January). IEEE Computer Society. https://doi.org/10.1109/ITHERM.2002.1012463

Chien, Liang Han ; Chang, C. C. / Experimental study of evaporation resistance on porous surfaces in flat heat pipes. ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. editor / Bahgat G. Sammakia ; Yogendra K. Joshi ; Ganesh Subbarayan ; Cristina H. Amon ; Koneru Ramakrishna ; Sanjeev B. Sathe. IEEE Computer Society, 2002. pp. 236-242 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

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abstract = "This experimental study investigated the effect of particle size and coating thickness of the porous surface on evaporator thermal resistance of a thermosyphon having a 16 mm diameter circular heating area. Copper particles having two kinds of size distributions were sintered on a copper plate. The two particle distributions were 115 μm average diameter in the range 50 to 500 μm, and 247 μm average diameter in the range 180 to 350 μm. The particle coating thickness was either 0.5 or 1.0 mm for each distribution. Water was used as the working fluid, and it was tested at 60 or 70°C saturation temperature, which corresponds to sub-atmospheric saturation pressure. The heat flux varied between 30 and 550 kW/m2. The boiling surfaces were tested in vertical and horizontal orientations, and the experimental results showed negligible effect on the surface orientation. The best boiling surface in the present study is obtained with a coating 1.0 mm thick and 247 μm average particle diameter. At 70°C this surface yielded less than 0.025 K/W evaporation thermal resistance at 93 W.",

keywords = "Coatings, Electronics cooling, Heat sinks, Heat transfer, Resistance heating, Surface resistance, Temperature, Testing, Thermal conductivity, Thermal resistance",

author = "Chien, {Liang Han} and Chang, {C. C.}",

note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 ; Conference date: 30-05-2002 Through 01-06-2002",

year = "2002",

doi = "10.1109/ITHERM.2002.1012463",

language = "英语",

series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",

publisher = "IEEE Computer Society",

pages = "236--242",

editor = "Sammakia, {Bahgat G.} and Joshi, {Yogendra K.} and Ganesh Subbarayan and Amon, {Cristina H.} and Koneru Ramakrishna and Sathe, {Sanjeev B.}",

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Chien, LH & Chang, CC 2002, Experimental study of evaporation resistance on porous surfaces in flat heat pipes. in BG Sammakia, YK Joshi, G Subbarayan, CH Amon, K Ramakrishna & SB Sathe (eds), ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems., 1012463, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, vol. 2002-January, IEEE Computer Society, pp. 236-242, 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002, San Diego, United States, 30/05/02. https://doi.org/10.1109/ITHERM.2002.1012463

Experimental study of evaporation resistance on porous surfaces in flat heat pipes. / Chien, Liang Han; Chang, C. C.
ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. ed. / Bahgat G. Sammakia; Yogendra K. Joshi; Ganesh Subbarayan; Cristina H. Amon; Koneru Ramakrishna; Sanjeev B. Sathe. IEEE Computer Society, 2002. p. 236-242 1012463 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2002-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Experimental study of evaporation resistance on porous surfaces in flat heat pipes

AU - Chien, Liang Han

AU - Chang, C. C.

PY - 2002

Y1 - 2002

N2 - This experimental study investigated the effect of particle size and coating thickness of the porous surface on evaporator thermal resistance of a thermosyphon having a 16 mm diameter circular heating area. Copper particles having two kinds of size distributions were sintered on a copper plate. The two particle distributions were 115 μm average diameter in the range 50 to 500 μm, and 247 μm average diameter in the range 180 to 350 μm. The particle coating thickness was either 0.5 or 1.0 mm for each distribution. Water was used as the working fluid, and it was tested at 60 or 70°C saturation temperature, which corresponds to sub-atmospheric saturation pressure. The heat flux varied between 30 and 550 kW/m2. The boiling surfaces were tested in vertical and horizontal orientations, and the experimental results showed negligible effect on the surface orientation. The best boiling surface in the present study is obtained with a coating 1.0 mm thick and 247 μm average particle diameter. At 70°C this surface yielded less than 0.025 K/W evaporation thermal resistance at 93 W.

AB - This experimental study investigated the effect of particle size and coating thickness of the porous surface on evaporator thermal resistance of a thermosyphon having a 16 mm diameter circular heating area. Copper particles having two kinds of size distributions were sintered on a copper plate. The two particle distributions were 115 μm average diameter in the range 50 to 500 μm, and 247 μm average diameter in the range 180 to 350 μm. The particle coating thickness was either 0.5 or 1.0 mm for each distribution. Water was used as the working fluid, and it was tested at 60 or 70°C saturation temperature, which corresponds to sub-atmospheric saturation pressure. The heat flux varied between 30 and 550 kW/m2. The boiling surfaces were tested in vertical and horizontal orientations, and the experimental results showed negligible effect on the surface orientation. The best boiling surface in the present study is obtained with a coating 1.0 mm thick and 247 μm average particle diameter. At 70°C this surface yielded less than 0.025 K/W evaporation thermal resistance at 93 W.

KW - Coatings

KW - Electronics cooling

KW - Heat sinks

KW - Heat transfer

KW - Resistance heating

KW - Surface resistance

KW - Temperature

KW - Testing

KW - Thermal conductivity

KW - Thermal resistance

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U2 - 10.1109/ITHERM.2002.1012463

DO - 10.1109/ITHERM.2002.1012463

M3 - 会议稿件

AN - SCOPUS:84950161744

T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

SP - 236

EP - 242

BT - ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

A2 - Sammakia, Bahgat G.

A2 - Joshi, Yogendra K.

A2 - Subbarayan, Ganesh

A2 - Amon, Cristina H.

A2 - Ramakrishna, Koneru

A2 - Sathe, Sanjeev B.

PB - IEEE Computer Society

T2 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002

Y2 - 30 May 2002 through 1 June 2002

ER -

Chien LH, Chang CC. Experimental study of evaporation resistance on porous surfaces in flat heat pipes. In Sammakia BG, Joshi YK, Subbarayan G, Amon CH, Ramakrishna K, Sathe SB, editors, ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. IEEE Computer Society. 2002. p. 236-242. 1012463. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). doi: 10.1109/ITHERM.2002.1012463

Experimental study of evaporation resistance on porous surfaces in flat heat pipes

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Keywords

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