Abstract
This experimental study investigated the effect of particle size and coating thickness of the porous surface on evaporator thermal resistance of the thermosyphon having a 16 mm diameter circular heating area. Copper particles having two kinds of size distributions were sintered on a copper plate. The two particle distributions are (1) 115 μm average diameter in the range of 50-to-500 μm, and (2) 247 μm average diameter in the range of 180-to-350 μm. The particle coating thickness was either 0.5 or 1.0 mm for each distribution. Water was used as the working fluid, and it was tested at 60 or 70°C saturation temperature, which corresponds to sub-atmosphere saturation pressure. The heat flux varied between 30 and 550 kW/m2. The boiling surfaces were tested in vertical and horizontal orientation, and the experimental results showed negligible effect on the surface orientation. The best boiling surface in the present study is obtained by coating 1.0 mm thick having 247 μm average particle diameter. At 70°C this surface yielded less than 0.025 K/W evaporation thermal resistance at 93 W.
| Original language | English |
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| Pages | 236-242 |
| Number of pages | 7 |
| State | Published - 2002 |
| Event | 8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems - San Diego, CA, United States Duration: 30 05 2002 → 01 06 2002 |
Conference
| Conference | 8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems |
|---|---|
| Country/Territory | United States |
| City | San Diego, CA |
| Period | 30/05/02 → 01/06/02 |
Keywords
- Boiling
- Electronic cooling
- Heat flux
- Porous surface
- Thermal resistance