Extrapolation of lifetime of high power LEDs under temperature-humidity conditions

Cher Ming Tan; Preetpal Singh

doi:10.1109/EDSSC.2014.7061079

Extrapolation of lifetime of high power LEDs under temperature-humidity conditions

Cher Ming Tan
, Preetpal Singh

Nanyang Technological University
Chang Gung University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

9 Scopus citations

Abstract

Lifetime of high power LEDs as lighting source is needed for its widespread adoption, and extrapolation of lifetime from accelerated stress is needed. Current practice of extrapolation is to use TM-21 and Peck model. In this work, we show that the use of Peck model is not correct, and the use of TM-21 must be done with cautions for the temperature range and the identification of possible mixture degradation mechanisms is needed before performing the extrapolation. Extrapolation of lifetime beyond 10% degradation may not be trivial due to the change in the degradation mechanism.

Original language	English
Title of host publication	2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781479923342
DOIs	https://doi.org/10.1109/EDSSC.2014.7061079
State	Published - 13 03 2014
Externally published	Yes
Event	2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014 - Chengdu, China Duration: 18 06 2014 → 20 06 2014

Publication series

Name	2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014

Conference

Conference	2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014
Country/Territory	China
City	Chengdu
Period	18/06/14 → 20/06/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

Keywords

Peck model
TM-21
activation energy
multiple failure mechanisms

Access to Document

10.1109/EDSSC.2014.7061079

Cite this

Tan, C. M., & Singh, P. (2014). Extrapolation of lifetime of high power LEDs under temperature-humidity conditions. In 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014 Article 7061079 (2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDSSC.2014.7061079

@inproceedings{380761e61650497b8e4de3cf2e747bf9,

title = "Extrapolation of lifetime of high power LEDs under temperature-humidity conditions",

abstract = "Lifetime of high power LEDs as lighting source is needed for its widespread adoption, and extrapolation of lifetime from accelerated stress is needed. Current practice of extrapolation is to use TM-21 and Peck model. In this work, we show that the use of Peck model is not correct, and the use of TM-21 must be done with cautions for the temperature range and the identification of possible mixture degradation mechanisms is needed before performing the extrapolation. Extrapolation of lifetime beyond 10\% degradation may not be trivial due to the change in the degradation mechanism.",

keywords = "Peck model, TM-21, activation energy, multiple failure mechanisms",

author = "Tan, \{Cher Ming\} and Preetpal Singh",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014 ; Conference date: 18-06-2014 Through 20-06-2014",

year = "2014",

month = mar,

day = "13",

doi = "10.1109/EDSSC.2014.7061079",

language = "英语",

series = "2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014",

address = "美国",

}

Tan, CM & Singh, P 2014, Extrapolation of lifetime of high power LEDs under temperature-humidity conditions. in 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014., 7061079, 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014, Institute of Electrical and Electronics Engineers Inc., 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014, Chengdu, China, 18/06/14. https://doi.org/10.1109/EDSSC.2014.7061079

Extrapolation of lifetime of high power LEDs under temperature-humidity conditions. / Tan, Cher Ming; Singh, Preetpal.
2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. 7061079 (2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Extrapolation of lifetime of high power LEDs under temperature-humidity conditions

AU - Tan, Cher Ming

AU - Singh, Preetpal

PY - 2014/3/13

Y1 - 2014/3/13

N2 - Lifetime of high power LEDs as lighting source is needed for its widespread adoption, and extrapolation of lifetime from accelerated stress is needed. Current practice of extrapolation is to use TM-21 and Peck model. In this work, we show that the use of Peck model is not correct, and the use of TM-21 must be done with cautions for the temperature range and the identification of possible mixture degradation mechanisms is needed before performing the extrapolation. Extrapolation of lifetime beyond 10% degradation may not be trivial due to the change in the degradation mechanism.

AB - Lifetime of high power LEDs as lighting source is needed for its widespread adoption, and extrapolation of lifetime from accelerated stress is needed. Current practice of extrapolation is to use TM-21 and Peck model. In this work, we show that the use of Peck model is not correct, and the use of TM-21 must be done with cautions for the temperature range and the identification of possible mixture degradation mechanisms is needed before performing the extrapolation. Extrapolation of lifetime beyond 10% degradation may not be trivial due to the change in the degradation mechanism.

KW - Peck model

KW - TM-21

KW - activation energy

KW - multiple failure mechanisms

UR - https://www.scopus.com/pages/publications/84949925911

U2 - 10.1109/EDSSC.2014.7061079

DO - 10.1109/EDSSC.2014.7061079

M3 - 会议稿件

AN - SCOPUS:84949925911

T3 - 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014

BT - 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014

Y2 - 18 June 2014 through 20 June 2014

ER -

Tan CM, Singh P. Extrapolation of lifetime of high power LEDs under temperature-humidity conditions. In 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. 7061079. (2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014). doi: 10.1109/EDSSC.2014.7061079

Extrapolation of lifetime of high power LEDs under temperature-humidity conditions

Abstract

Publication series

Conference

Bibliographical note

Keywords

Access to Document

Other files and links

Fingerprint

Cite this