Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

Cheng Chen Lin; Liann Be Chang; Ming Jer Jeng; Chia Yi Yen; Atanu Das; Chung Yi Tang; Ming Yi Tsai; Mu Jen Lai

doi:10.1016/j.microrel.2010.01.036

Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

Cheng Chen Lin^*
, Liann Be Chang
, Ming Jer Jeng
, Chia Yi Yen
, Atanu Das
, Chung Yi Tang
, Ming Yi Tsai
, Mu Jen Lai

^*Corresponding author for this work

Chang Gung University

Research output: Contribution to journal › Journal Article › peer-review

20 Scopus citations

Abstract

The thermal performance of flip-chip (FC) light-emitting diodes (LEDs) with different numbers of Au stub bumps has been investigated by using thermosonic bonder. The LEDs were mounted on the aluminium nitride (AlN) sub-mounts which have superior thermal conductivity (230 W/mK), and the high power Chip-on-Plate (COP) package was proposed to be used for our measurement. In order to understand the thermal performance of the high power FC-LEDs, the experimental measurement and finite-element model (FRM) numerical simulation have been used. It is found that the thermal performance of our 1 × 1 mm² FC-LEDs can only be improved when using at least 6 Au stub bumps as interconnected metals. Moreover, the surface temperature of FC-LEDs is significantly reduced while using 20 Au stub bumps.

Original language	English
Pages (from-to)	683-687
Number of pages	5
Journal	Microelectronics Reliability
Volume	50
Issue number	5
DOIs	https://doi.org/10.1016/j.microrel.2010.01.036
State	Published - 05 2010

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10.1016/j.microrel.2010.01.036

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title = "Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps",

abstract = "The thermal performance of flip-chip (FC) light-emitting diodes (LEDs) with different numbers of Au stub bumps has been investigated by using thermosonic bonder. The LEDs were mounted on the aluminium nitride (AlN) sub-mounts which have superior thermal conductivity (230 W/mK), and the high power Chip-on-Plate (COP) package was proposed to be used for our measurement. In order to understand the thermal performance of the high power FC-LEDs, the experimental measurement and finite-element model (FRM) numerical simulation have been used. It is found that the thermal performance of our 1 × 1 mm2 FC-LEDs can only be improved when using at least 6 Au stub bumps as interconnected metals. Moreover, the surface temperature of FC-LEDs is significantly reduced while using 20 Au stub bumps.",

author = "Lin, \{Cheng Chen\} and Chang, \{Liann Be\} and Jeng, \{Ming Jer\} and Yen, \{Chia Yi\} and Atanu Das and Tang, \{Chung Yi\} and Tsai, \{Ming Yi\} and Lai, \{Mu Jen\}",

year = "2010",

month = may,

doi = "10.1016/j.microrel.2010.01.036",

language = "英语",

volume = "50",

pages = "683--687",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Ltd",

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TY - JOUR

T1 - Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

AU - Lin, Cheng Chen

AU - Chang, Liann Be

AU - Jeng, Ming Jer

AU - Yen, Chia Yi

AU - Das, Atanu

AU - Tang, Chung Yi

AU - Tsai, Ming Yi

AU - Lai, Mu Jen

PY - 2010/5

Y1 - 2010/5

N2 - The thermal performance of flip-chip (FC) light-emitting diodes (LEDs) with different numbers of Au stub bumps has been investigated by using thermosonic bonder. The LEDs were mounted on the aluminium nitride (AlN) sub-mounts which have superior thermal conductivity (230 W/mK), and the high power Chip-on-Plate (COP) package was proposed to be used for our measurement. In order to understand the thermal performance of the high power FC-LEDs, the experimental measurement and finite-element model (FRM) numerical simulation have been used. It is found that the thermal performance of our 1 × 1 mm2 FC-LEDs can only be improved when using at least 6 Au stub bumps as interconnected metals. Moreover, the surface temperature of FC-LEDs is significantly reduced while using 20 Au stub bumps.

AB - The thermal performance of flip-chip (FC) light-emitting diodes (LEDs) with different numbers of Au stub bumps has been investigated by using thermosonic bonder. The LEDs were mounted on the aluminium nitride (AlN) sub-mounts which have superior thermal conductivity (230 W/mK), and the high power Chip-on-Plate (COP) package was proposed to be used for our measurement. In order to understand the thermal performance of the high power FC-LEDs, the experimental measurement and finite-element model (FRM) numerical simulation have been used. It is found that the thermal performance of our 1 × 1 mm2 FC-LEDs can only be improved when using at least 6 Au stub bumps as interconnected metals. Moreover, the surface temperature of FC-LEDs is significantly reduced while using 20 Au stub bumps.

UR - https://www.scopus.com/pages/publications/77953138268

U2 - 10.1016/j.microrel.2010.01.036

DO - 10.1016/j.microrel.2010.01.036

M3 - 文章

AN - SCOPUS:77953138268

SN - 0026-2714

VL - 50

SP - 683

EP - 687

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 5

ER -

Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

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