Fabrication and Thermal Analysis of Flip Chip Light Emitting Diodes with Different Numbers of Au Stub Bumps

Cheng-Chen Lin, Xin-Hong Qian, Liann-Be Chang, Chung-Yi Tang, Ming-Yi Tsai

Research output: Contribution to conference › Proceeding

Original language	American English
State	Published - 2009
Event	2009 International Electron Devices and Materials Symposia (IEDMS 2009) - Taoyuan, Taiwan Duration: 19 11 2009 → 20 11 2009

Conference	2009 International Electron Devices and Materials Symposia (IEDMS 2009)
Period	19/11/09 → 20/11/09

Cite this

@conference{92681dce2ed045bcbac8d62f635222ea,

title = "Fabrication and Thermal Analysis of Flip Chip Light Emitting Diodes with Different Numbers of Au Stub Bumps",

author = "Cheng-Chen Lin and Xin-Hong Qian and Liann-Be Chang and Chung-Yi Tang and Ming-Yi Tsai",

year = "2009",

language = "American English",

note = "2009 International Electron Devices and Materials Symposia (IEDMS 2009) ; Conference date: 19-11-2009 Through 20-11-2009",

}

TY - CONF

T1 - Fabrication and Thermal Analysis of Flip Chip Light Emitting Diodes with Different Numbers of Au Stub Bumps

AU - Lin, Cheng-Chen

AU - Qian, Xin-Hong

AU - Chang, Liann-Be

AU - Tang, Chung-Yi

AU - Tsai, Ming-Yi

PY - 2009

Y1 - 2009

M3 - Proceeding

T2 - 2009 International Electron Devices and Materials Symposia (IEDMS 2009)

Y2 - 19 November 2009 through 20 November 2009

ER -