Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

Cher Ming Tan; Zhenghao Gan

doi:10.1109/TDMR.2003.814408

Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

Cher Ming Tan^*, Zhenghao Gan

^*Corresponding author for this work

Nanyang Technological University

Research output: Contribution to journal › Journal Article › peer-review

15 Scopus citations

Abstract

Aluminum bondpad peeling was observed in a newly developed thermosonic wirebonding process for chip-on-board assembly. Through detailed failure analysis and with the help of finite element analysis on stress simulation, the true root cause of the peeling is identified. It is found that the true root cause is the effect of skidding force as a result of the constrained movement of the bonding tool as bonding is done on a chip assembled in a plastic casing. With a change in the bonding tool movement, the peeling phenomenon is completely eliminated.

Original language	English
Pages (from-to)	44-50
Number of pages	7
Journal	IEEE Transactions on Device and Materials Reliability
Volume	3
Issue number	2
DOIs	https://doi.org/10.1109/TDMR.2003.814408
State	Published - 06 2003
Externally published	Yes

Keywords

Bondpad peeling
Confocal microscope
Failure mechanism
Finite element analysis
Skidding
Thermosonic bonding

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10.1109/TDMR.2003.814408

Cite this

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title = "Failure mechanisms of aluminum bondpad peeling during thermosonic bonding",

abstract = "Aluminum bondpad peeling was observed in a newly developed thermosonic wirebonding process for chip-on-board assembly. Through detailed failure analysis and with the help of finite element analysis on stress simulation, the true root cause of the peeling is identified. It is found that the true root cause is the effect of skidding force as a result of the constrained movement of the bonding tool as bonding is done on a chip assembled in a plastic casing. With a change in the bonding tool movement, the peeling phenomenon is completely eliminated.",

keywords = "Bondpad peeling, Confocal microscope, Failure mechanism, Finite element analysis, Skidding, Thermosonic bonding",

author = "Tan, \{Cher Ming\} and Zhenghao Gan",

year = "2003",

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doi = "10.1109/TDMR.2003.814408",

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volume = "3",

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T1 - Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

AU - Tan, Cher Ming

AU - Gan, Zhenghao

PY - 2003/6

Y1 - 2003/6

N2 - Aluminum bondpad peeling was observed in a newly developed thermosonic wirebonding process for chip-on-board assembly. Through detailed failure analysis and with the help of finite element analysis on stress simulation, the true root cause of the peeling is identified. It is found that the true root cause is the effect of skidding force as a result of the constrained movement of the bonding tool as bonding is done on a chip assembled in a plastic casing. With a change in the bonding tool movement, the peeling phenomenon is completely eliminated.

AB - Aluminum bondpad peeling was observed in a newly developed thermosonic wirebonding process for chip-on-board assembly. Through detailed failure analysis and with the help of finite element analysis on stress simulation, the true root cause of the peeling is identified. It is found that the true root cause is the effect of skidding force as a result of the constrained movement of the bonding tool as bonding is done on a chip assembled in a plastic casing. With a change in the bonding tool movement, the peeling phenomenon is completely eliminated.

KW - Bondpad peeling

KW - Confocal microscope

KW - Failure mechanism

KW - Finite element analysis

KW - Skidding

KW - Thermosonic bonding

UR - https://www.scopus.com/pages/publications/3042726795

U2 - 10.1109/TDMR.2003.814408

DO - 10.1109/TDMR.2003.814408

M3 - 文章

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SP - 44

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JO - IEEE Transactions on Device and Materials Reliability

JF - IEEE Transactions on Device and Materials Reliability

IS - 2

ER -

Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

Abstract

Keywords

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