Finite element modeling of capacitive coupling voltage contrast

Cher Ming Tan*, Stanny Yanuar, Tai Chong Chai

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review


Capacitive coupling voltage contrast (CCVC) is proven to be able to detect broken track in high density organic substrate with solder mask on top of the tracks. In this work, we develop a finite element model to solve the electromagnetic equations and determine the surface voltage of the solder mask under the interaction of the electron beam and the electrostatic induction due to the biasing of the underlying track. As the brightness of an image under SEM depends on the surface voltage of the object under observation, our model is able to explain the experimental observations of CCVC accurately. This model also examines the limitation of the CCVC.

Original languageEnglish
Pages (from-to)1555-1560
Number of pages6
JournalMicroelectronics Reliability
Issue number9-11 SPEC. ISS.
StatePublished - 08 2007
Externally publishedYes


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