Abstract
Room temperature deposition in H2SiF6 solution, i.e., liquid phase deposition (LPD), followed by furnace oxidation (FO) is first used to prepare fluorinated thin oxides (LPD/FO). The amount of fluorine existing in the gate oxide is controlled by varying the LPD time in this work. A turnaround breakdown behavior is observed for LPD/FO oxides with various LPD conditions. The oxide with an optimized fluorine concentration shows a significant improvement in oxide breakdown characteristics.
Original language | English |
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Pages (from-to) | 671-676 |
Number of pages | 6 |
Journal | Solid-State Electronics |
Volume | 43 |
Issue number | 3 |
DOIs | |
State | Published - 1999 |
Externally published | Yes |