Abstract
Room temperature deposition in H2SiF6 solution, i.e., liquid phase deposition (LPD), followed by furnace oxidation (FO) is first used to prepare fluorinated thin oxides (LPD/FO). The amount of fluorine existing in the gate oxide is controlled by varying the LPD time in this work. A turnaround breakdown behavior is observed for LPD/FO oxides with various LPD conditions. The oxide with an optimized fluorine concentration shows a significant improvement in oxide breakdown characteristics.
| Original language | English |
|---|---|
| Pages (from-to) | 671-676 |
| Number of pages | 6 |
| Journal | Solid-State Electronics |
| Volume | 43 |
| Issue number | 3 |
| DOIs | |
| State | Published - 1999 |
| Externally published | Yes |