Fully inkjet-printed three-dimensional bandpass filter on liquid crystal polymer substrate

Hsuan Ling Kao, Cheng Lin Cho

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

This paper has presented a three-dimensional bandpass filter using fully inkjet-printing technology, which can reduce chip size and improve performance. Inkjet-printed silver film and SU-8 polymer film were used as metal layer and dielectric layer to achieve three-dimensional structure. Vertical interconnections were realized using inkjet-printing technology filled by silver ink and isolated by SU-8 film. Fully inkjet-printed hairpin bandpass filter with two meandered half-wavelength microstrip lines was fabricated for cross-coupled and size reduction. The minimal insertion loss and maximal return loss at 12 GHz were -2.35 dB and -17.4 dB, respectively. Fully inkjet-printed three-dimensional bandpass filter demonstrated compact size and acceptable performance which make it attractive for RF applications.

Original languageEnglish
Title of host publicationProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2218-2222
Number of pages5
ISBN (Print)9781538649985
DOIs
StatePublished - 07 08 2018
Event68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States
Duration: 29 05 201801 06 2018

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2018-May
ISSN (Print)0569-5503

Conference

Conference68th IEEE Electronic Components and Technology Conference, ECTC 2018
Country/TerritoryUnited States
CitySan Diego
Period29/05/1801/06/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

Keywords

  • Bandpass filter
  • Fully inkjet-printed
  • SU-8 polymer ink
  • Siliver ink

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