Abstract
Electroless plating of metals is an important industry process. However, the reducing agents and chemicals needed for electroless plating comprise of non-biodegradable and bio-hazardous species which adds to the environmental-deterioration cost along with the price of the chemicals. We recently discovered that the electrochemical properties of Graphene can serve as an excellent reducing agent for electroless plating processes. We demonstrate the use of Graphene for Copper electroless plating in this work, and the resulting Copper layer possess better electrical and thermal properties than the Copper itself due to the presence of the Graphene. The theoretical basis of such technology as have been published elsewhere show that such technology can be applied to metals such as Nickel, Titanium, Aluminum, Gold, Silver, and Cobalt.
Original language | English |
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Title of host publication | 2018 IEEE 13th Nanotechnology Materials and Devices Conference, NMDC 2018 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781538610169 |
DOIs | |
State | Published - 08 01 2019 |
Event | 13th IEEE Nanotechnology Materials and Devices Conference, NMDC 2018 - Portland, United States Duration: 14 10 2018 → 17 10 2018 |
Publication series
Name | 2018 IEEE 13th Nanotechnology Materials and Devices Conference, NMDC 2018 |
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Conference
Conference | 13th IEEE Nanotechnology Materials and Devices Conference, NMDC 2018 |
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Country/Territory | United States |
City | Portland |
Period | 14/10/18 → 17/10/18 |
Bibliographical note
Publisher Copyright:© 2018 IEEE.
Keywords
- Copper-Graphene-Copper film
- Electroless plating
- Graphenated Copper
- Graphene