Graphene as a reducing agent for electroless plating of metal

Udit Narula, Cher Ming Tan, Eng Soon Tok

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Electroless plating of metals is an important industry process. However, the reducing agents and chemicals needed for electroless plating comprise of non-biodegradable and bio-hazardous species which adds to the environmental-deterioration cost along with the price of the chemicals. We recently discovered that the electrochemical properties of Graphene can serve as an excellent reducing agent for electroless plating processes. We demonstrate the use of Graphene for Copper electroless plating in this work, and the resulting Copper layer possess better electrical and thermal properties than the Copper itself due to the presence of the Graphene. The theoretical basis of such technology as have been published elsewhere show that such technology can be applied to metals such as Nickel, Titanium, Aluminum, Gold, Silver, and Cobalt.

Original languageEnglish
Title of host publication2018 IEEE 13th Nanotechnology Materials and Devices Conference, NMDC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538610169
DOIs
StatePublished - 08 01 2019
Event13th IEEE Nanotechnology Materials and Devices Conference, NMDC 2018 - Portland, United States
Duration: 14 10 201817 10 2018

Publication series

Name2018 IEEE 13th Nanotechnology Materials and Devices Conference, NMDC 2018

Conference

Conference13th IEEE Nanotechnology Materials and Devices Conference, NMDC 2018
Country/TerritoryUnited States
CityPortland
Period14/10/1817/10/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

Keywords

  • Copper-Graphene-Copper film
  • Electroless plating
  • Graphenated Copper
  • Graphene

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