Hafnium oxide gate dielectric for strained-Si1-xGex

C. K. Maiti*, S. Maikap, S. Chatterjee, S. K. Nandi, S. K. Samanta

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

22 Scopus citations

Abstract

Ultrathin hafnium oxide (HfO2) films have been deposited by rf sputtering on strained-Si0.81Ge0.19 films. The structure and chemical composition of the deposited films have been studied using high resolution transmission electron microscopy, time-of-flight secondary ion mass spectroscopy and X-ray photo-electron spectroscopy techniques. Current conduction mechanism in HfO2 films has been studied using current-voltage (I-V) characteristics. The leakage current is found to be dominated by the Schottky emission at a low electric field, whereas Poole-Frenkel emission takes over at a high electric field.

Original languageEnglish
Pages (from-to)1995-2000
Number of pages6
JournalSolid-State Electronics
Volume47
Issue number11
DOIs
StatePublished - 11 2003
Externally publishedYes

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