Abstract
In this study, a AlGaN/GaN high-electron-mobility transistor (HEMT) grown on the bulk GaN substrate was demonstrated and compared against one grown on the SiC substrate. Results of X-ray diffraction and reciprocal space mapping revealed that the bulk GaN substrate structure exhibited less lattice dislocation. The GaN substrate device demonstrated better IDS–VGS and gm–VGS characteristics of IDS = 700 mA/mm at VGS = +2 V and gmmax = 148 mS/mm. Compared with the SiC substrate, the current density in the HEMT grown on GaN was improved. The GaN substrate also improved current collapse and dynamic ON-state resistance due to a decrease in the trapping effect. The low-frequency noise and Hooge results also indicated that the GaN substrate had lower lattice dislocation.
Original language | English |
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State | Published - 2019 |
Event | 2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019 - Minneapolis, United States Duration: 29 04 2019 → 02 05 2019 |
Conference
Conference | 2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019 |
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Country/Territory | United States |
City | Minneapolis |
Period | 29/04/19 → 02/05/19 |
Bibliographical note
Publisher Copyright:© 2019 CS Mantech. All rights reserved.
Keywords
- Bulk GaN substrate
- Gallium nitride
- Microwave device