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High thermally stable AlGaN/GaN high electron mobility transistors (HEMTs) on bulk semi-insulating GaN substrates

  • Hao Yu Wang
  • , Hsien Chin Chiu*
  • , Chong Rong Huang
  • , Hao Chung Kuo
  • , Sung Wen Huang Chen
  • , Xinke Liu
  • *Corresponding author for this work
  • Chang Gung University
  • National Yang Ming Chiao Tung University
  • Shenzhen University

Research output: Contribution to conferenceConference Paperpeer-review

Abstract

In this study, a AlGaN/GaN high-electron-mobility transistor (HEMT) grown on the bulk GaN substrate was demonstrated and compared against one grown on the SiC substrate. Results of X-ray diffraction and reciprocal space mapping revealed that the bulk GaN substrate structure exhibited less lattice dislocation. The GaN substrate device demonstrated better IDS–VGS and gm–VGS characteristics of IDS = 700 mA/mm at VGS = +2 V and gmmax = 148 mS/mm. Compared with the SiC substrate, the current density in the HEMT grown on GaN was improved. The GaN substrate also improved current collapse and dynamic ON-state resistance due to a decrease in the trapping effect. The low-frequency noise and Hooge results also indicated that the GaN substrate had lower lattice dislocation.

Original languageEnglish
StatePublished - 2019
Event2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019 - Minneapolis, United States
Duration: 29 04 201902 05 2019

Conference

Conference2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019
Country/TerritoryUnited States
CityMinneapolis
Period29/04/1902/05/19

Bibliographical note

Publisher Copyright:
© 2019 CS Mantech. All rights reserved.

Keywords

  • Bulk GaN substrate
  • Gallium nitride
  • Microwave device

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