Hybrid routing on multichip modules

Chia Chun Tsai*, Sao Jie Chen, Pei Yung Hsiao, Wu Shiung Feng

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A hybrid routing approach for multichip modules (MCMs) is proposed. The routing implementation is divided into three stages: signal-net routing, I/O-pad interconnection, and power/ground layout. A special feature of the implementation is that, in the second stage, some interconnected segments are allowed to be tilted with a slope for reducing the MCM layout area. Experimental results on MCM examples indicate that the performance of the hybrid routing is very encouraging.

Original languageEnglish
Title of host publicationProceedings of the Custom Integrated Circuits Conference
PublisherPubl by IEEE
ISBN (Print)0780300157
StatePublished - 1991
EventProceedings of the IEEE 1991 Custom Integrated Circuits Conference - San Diego, CA, USA
Duration: 12 05 199115 05 1991

Publication series

NameProceedings of the Custom Integrated Circuits Conference
ISSN (Print)0886-5930

Conference

ConferenceProceedings of the IEEE 1991 Custom Integrated Circuits Conference
CitySan Diego, CA, USA
Period12/05/9115/05/91

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