IC構裝熱應力及變形之理論建立與有限元素模擬

Translated title of the contribution: Stress and Deformation Analyses of IC Package Under Thermal Loads : Theoretical and FEM Studies
  • 陳佑寧

Research output: Types of Thesis › Master's thesis

Translated title of the contributionStress and Deformation Analyses of IC Package Under Thermal Loads : Theoretical and FEM Studies
Original languageChinese (Traditional)
Supervisors/Advisors
  • Tsai, Ming-Yi, Supervisor
StatePublished - 1998
Externally publishedYes

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