Abstract
Silicon wafers were preamorphized to investigate the impact of carbon on the deactivation behaviors of boron and phosphorus. The boron deactivation caused by carbon was observed with solid phase epitaxial regrowth (SPER) at the beginning of rapid thermal annealing (RTA) at 600 °C. However, carbon reduced further boron deactivation when interstitials were released from end-of-range (EOR) defects during subsequent furnace annealing (FA) at 800 °C. Phosphorus deactivation was enhanced by carbon during RTA at 600 °C. Such deactivation was enlarged with further FA at 800 and 850 °C. This indicates that the reaction between carbon and phosphorus primarily occurred in crystalline silicon and the reaction was not associated with excess interstitials.
| Original language | English |
|---|---|
| Title of host publication | 2018 22nd International Conference on Ion Implantation Technology, IIT 2018 - Proceedings |
| Editors | Heiner Ryssel, Volker Haublein |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 86-89 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781538668283 |
| DOIs | |
| State | Published - 09 2018 |
| Event | 22nd International Conference on Ion Implantation Technology, IIT 2018 - Wurzburg, Germany Duration: 16 09 2018 → 21 09 2018 |
Publication series
| Name | Proceedings of the International Conference on Ion Implantation Technology |
|---|---|
| Volume | 2018-September |
Conference
| Conference | 22nd International Conference on Ion Implantation Technology, IIT 2018 |
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| Country/Territory | Germany |
| City | Wurzburg |
| Period | 16/09/18 → 21/09/18 |
Bibliographical note
Publisher Copyright:© 2018 IEEE.
Keywords
- boron
- carbon
- deactivation
- phosphorus
- preamorphization