Impact of high-κ TaOx thickness on the switching mechanism of resistive memory device using IrOx/TaOx/WO x/W structure

A. Prakash*, S. Maikap, W. S. Chen, H. Y. Lee, F. T. Chen, M. J. Kao, M. J. Tsai

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

The impact of switching layer thickness on the resistive memory performance and uniformity has been investigated in a simple stack of IrO x/TaOx/W fabricated. The formation of amorphous TaO x and nanocrystalline WOx layers are confirmed from HRTEM image. Bipolar resistive switching memory characteristics with small set/reset and large memory window are observed in all devices after electroforming. The observed TaOx thickness independence of set/reset and low resistance state (LRS) is attributed to the formation of localized nano-filament in TaOx layer. Cumulative probability plot shows tight distribution of LRS. Good data retention with a large resistance ratio of >103 at 85°C is obtained.

Original languageEnglish
Title of host publicationDielectrics for Nanosystems 5
Subtitle of host publicationMaterials Science, Processing, Reliability, and Manufacturing -and- Tutorials in Nanotechnology: More than Moore - Beyond CMOS Emerging Materials and Devices
PublisherElectrochemical Society Inc.
Pages379-385
Number of pages7
Edition3
ISBN (Electronic)9781607683131
ISBN (Print)9781566779555
DOIs
StatePublished - 2012
Event5th International Symposium on Dielectrics for Nanosystems: Materials Science, Processing, Reliability and Manufacturing - 221st ECS Meeting - Seattle, WA, United States
Duration: 06 05 201210 05 2012

Publication series

NameECS Transactions
Number3
Volume45
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

Conference5th International Symposium on Dielectrics for Nanosystems: Materials Science, Processing, Reliability and Manufacturing - 221st ECS Meeting
Country/TerritoryUnited States
CitySeattle, WA
Period06/05/1210/05/12

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