Improvement on yield of anisotropic conductive film attach process in TFT-LCD module using Taguchi method

Jian Long Kuo*, Kai Lun Chao, Chung Hao Hsieh

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review


Anisotropic Conductive Film (ACF) is one of the important materials in LCM (Liquid Crystal Module) process, it is used in bonding process to make the driving circuit conductive. Because the price of TFT-LCD is much lower than before in recent years, the ACF cost has higher ratio in manufacture cost. The conventional long bar ACF attach unit is changed to short bar ACF attach unit in new bonding equipment. However, the new type machine was not optimized in process and mechanical design. Therefore, the failure rate of ACF attach process is much higher than the one of conventional method. This wastes the material and rework cost is also invisible. How to make the manufacturing cost down effectively and promote the product quality will be the important concern to keep the product competition. Therefore, the Taguchi method is used to analyze the problem. The ACF attach yield rate is selected to be objective function for optimization. By the optimization of quality characteristic using Taguchi method, the plasma clean speed, ACF peeling speed and ACF cutter spring setting are studied to optimize the design parameters.

Original languageEnglish
Title of host publicationAdvances in Materials Processing IX
PublisherTrans Tech Publications Ltd
Number of pages6
ISBN (Print)0878492674, 9780878492671
StatePublished - 2010
Externally publishedYes
Event9th Asia-Pacific Conference on Materials Processing, APCMP2010 - Sydney, NSW, Australia
Duration: 07 06 201010 06 2010

Publication series

NameKey Engineering Materials
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795


Conference9th Asia-Pacific Conference on Materials Processing, APCMP2010
CitySydney, NSW


  • ACF
  • Plasma clean
  • Taguchi method


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