Improving diamond-metal adhesion with graded TiCN interlayers

Chang Q. Sun*, Y. Q. Fu, B. B. Yan, J. H. Hsieh, S. P. Lau, X. W. Sun, B. K. Tay

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

24 Scopus citations

Abstract

An approach improving diamond-metal adhesion has been developed based on modeling predictions and experimental verifications on the interfacial stresses modified by catalytic reaction. It is found that N-plasma irradiating onto Ti and tungsten-carbide substrates generates tensile surface stresses while C-plasma irradiation creates strongly compressive stress at the surfaces, both of which deteriorate the diamond-metal adhesion. It is also found that surface oxidation prevents diamond nucleation. Therefore, we applied a graded TiCN interlayer with carefully adjusting the ratio of C and N in the gas mixture to neutralize the interfacial stress and, hence, we have improved the diamond-metal adhesion substantially.

Original languageEnglish
Pages (from-to)2051-2054
Number of pages4
JournalJournal of Applied Physics
Volume91
Issue number3
DOIs
StatePublished - 01 02 2002
Externally publishedYes

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