@inproceedings{d777cdefdb55482498bea52933e85f47,
title = "Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes",
abstract = "In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into Sn-Ag-Cu solder, to form a nanocomposite solder. The creep behavior and hardness of composite and Sn-Ag-Cu solder samples were studied using the Berkvich depth-sensing indentation at room temperature. Characterization results revealed that with increasing addition of Ni-coated carbon nanotubes, an increasing improvement in the creep behavior of composite solder was observed. Moreover, the results also showed that the nanoindentation hardness increased by 18.1\% with the incorporation of 0.03 wt.\% of Ni-coated CNTs.",
author = "Han, \{Y. D.\} and Jing, \{H. Y.\} and Nai, \{S. M.L.\} and Xu, \{L. Y.\} and Tan, \{C. M.\} and J. Wei",
year = "2010",
doi = "10.1109/INEC.2010.5424643",
language = "英语",
isbn = "9781424435449",
series = "INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings",
pages = "219--221",
booktitle = "INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings",
note = "2010 3rd International Nanoelectronics Conference, INEC 2010 ; Conference date: 03-01-2010 Through 08-01-2010",
}