Indentation size effect on the hardness of a sn-Ag-Cu solder

Y. D. Han, S. M.L. Nai, L. Y. Xu, H. Y. Jing, C. M. Tan, J. Wei

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In the present study, nanoindentation studies of the 95.8Sn3.5Ag-0.7Cu lead-free solder were conducted over a range of maximum loads from 20mN to 100mN, under a constant ramp rate of 0.05s-1. The indentation scale dependence of hardness was investigated. The results revealed that the hardness is dependent on the indentation depth. As the maximum holding load increased, which corresponded to an increasing indentation depth, a decreasing trend in the hardness was observed.

Original languageEnglish
Title of host publicationProceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages137-141
Number of pages5
ISBN (Print)9780791843789
DOIs
StatePublished - 2010
Externally publishedYes
Event2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009 - Lake Buena Vista, FL, United States
Duration: 13 11 200919 11 2009

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings
Volume5

Conference

Conference2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009
Country/TerritoryUnited States
CityLake Buena Vista, FL
Period13/11/0919/11/09

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