@inproceedings{c5f786349c684b75b61d47092010ad53,
title = "Indentation size effect on the hardness of a sn-Ag-Cu solder",
abstract = "In the present study, nanoindentation studies of the 95.8Sn3.5Ag-0.7Cu lead-free solder were conducted over a range of maximum loads from 20mN to 100mN, under a constant ramp rate of 0.05s-1. The indentation scale dependence of hardness was investigated. The results revealed that the hardness is dependent on the indentation depth. As the maximum holding load increased, which corresponded to an increasing indentation depth, a decreasing trend in the hardness was observed.",
author = "Han, {Y. D.} and Nai, {S. M.L.} and Xu, {L. Y.} and Jing, {H. Y.} and Tan, {C. M.} and J. Wei",
year = "2010",
doi = "10.1115/IMECE2009-10551",
language = "英语",
isbn = "9780791843789",
series = "ASME International Mechanical Engineering Congress and Exposition, Proceedings",
publisher = "American Society of Mechanical Engineers (ASME)",
pages = "137--141",
booktitle = "Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009",
address = "美国",
note = "2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009 ; Conference date: 13-11-2009 Through 19-11-2009",
}