Injection molding of delamination-free ultra-high-molecular-weight polyethylene

Galip Yilmaz, Huaguang Yang, Lih Sheng Turng*

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

9 Scopus citations


When ultra-high-molecular-weight polyethylene (UHMWPE) in powder form is injection molded, the so-called delamination layering occurs near the skin of the parts. This layering defect hampers UHMWPE's superior wear resistance property and part surface quality. The delamination layer was caused by a combination of excessive shear stress near the part surface and high degree of molecular entanglement of UHMWPE. A mold insulation method that delays the rapid cooling of UHMWPE to reduce the shear stress and improve the polymer chain “interdiffusion” across the entangled chain bundles was used to eliminate the delamination layer. When the insulation layer thickness and mold temperature were optimized, the delamination layer was eliminated completely while still maintaining a reasonable cooling/cycle time. The delamination-free parts were found to regain UHMWPE's superior impact resistance and tensile properties. POLYM. ENG. SCI., 59:2313–2322, 2019.

Original languageEnglish
Pages (from-to)2313-2322
Number of pages10
JournalPolymer Engineering and Science
Issue number11
StatePublished - 01 11 2019
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2019 Society of Plastics Engineers


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