Interconnect EM reliability modeling at circuit layout level

Cher Ming Tan*, Feifei He

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

Abstract

The circuit models built in Chaps. 2 and 3 only consider the intra-block interconnects and simple inter-block connections up to Metal 2. Realistic circuits consist of a large number of transistors and other circuit components connected by complex inter-block connections made of multiple metal layers. In this chapter, a complete 3D circuit model including both intra- and inter-block interconnects is constructed. Electro-thermo-structural simulations are performed, and the modifications that can help enhancing the EM reliability of the circuit are carried out based on the observations in the simulation.

Original languageEnglish
Pages (from-to)75-99
Number of pages25
JournalSpringerBriefs in Applied Sciences and Technology
Issue number9789814451208
DOIs
StatePublished - 2013
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2013, The Author(s).

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