Abstract
The circuit models built in Chaps. 2 and 3 only consider the intra-block interconnects and simple inter-block connections up to Metal 2. Realistic circuits consist of a large number of transistors and other circuit components connected by complex inter-block connections made of multiple metal layers. In this chapter, a complete 3D circuit model including both intra- and inter-block interconnects is constructed. Electro-thermo-structural simulations are performed, and the modifications that can help enhancing the EM reliability of the circuit are carried out based on the observations in the simulation.
Original language | English |
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Pages (from-to) | 75-99 |
Number of pages | 25 |
Journal | SpringerBriefs in Applied Sciences and Technology |
Issue number | 9789814451208 |
DOIs | |
State | Published - 2013 |
Externally published | Yes |
Bibliographical note
Publisher Copyright:© 2013, The Author(s).