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Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling
Y. D. Han*, H. Y. Jing, S. M.L. Nai, L. Y. Xu, C. M. Tan, J. Wei
*Corresponding author for this work
Research output: Contribution to journal › Journal Article › peer-review
84
Scopus
citations