Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling

Y. D. Han*, H. Y. Jing, S. M.L. Nai, L. Y. Xu, C. M. Tan, J. Wei

*Corresponding author for this work

Research output: Contribution to journalJournal Article peer-review

77 Scopus citations

Fingerprint

Dive into the research topics of 'Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling'. Together they form a unique fingerprint.

Material Science

Physics

Earth and Planetary Sciences